Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Kohara, Sayuri
22  Ergebnisse:
Personensuche X
?
1

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 269-273 , 2024
Link: https://doi.org/10.1109/..
 
?
2

Direct Bonded Heterogeneous Integration (DBHi): Surface Bri..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pulido, Claudia Cristina Barrera ; Kohara, Sayuri ; Jain, Aakrati... - p. 1053-1059 , 2023
Link: https://doi.org/10.1109/..
 
?
3

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023
Link: https://doi.org/10.1109/..
 
?
4

Thermo-mechanical Analysis of Thermal Compression Bonding C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chowdhury, Prabudhya Roy ; Sakuma, Katsuyuki ; Raghavan, Sathya... - p. 579-585 , 2022
Link: https://doi.org/10.1109/..
 
?
5

Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 625-630 , 2022
Link: https://doi.org/10.1109/..
 
?
6

Analysis of process dependent mechanical properties of sint..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kohara, Sayuri ; Aoki, Toyohiro ; Marushima, Chinami... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
?
7

Surface Silicon Bridge Direct Bonded Heterogeneous Integrat..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Sikka, Kamal ; Sousa, Isabel De ; Jain, Aakrati... - p. 145-147 , 2022
Link: https://doi.org/10.1109/..
 
?
8

Thermomechanical Analysis on Stress Mitigation of FCPBGA wi..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Hisada, Takashi ; Kohara, Sayuri ; Marushima, Chinami. - p. 207-208 , 2022
Link: https://doi.org/10.23919..
 
?
9

Morphology and Mechanical property of Cu pillar formed by s..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Marushima, Chinami ; Aoki, Toyohiro ; Kohara, Sayuri... - p. 121-122 , 2021
Link: https://doi.org/10.23919..
 
?
10

Plating-free Bumping by Cu Nanopaste and Injection Molded S..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Aoki, Toyohiro ; Nakamura, Eiji ; Kohara, Sayuri... - p. 742-748 , 2020
Link: https://doi.org/10.1109/..
 
?
11

Effects of in-plane property variations on warpage shapes o..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Kohara, Sayuri ; Okamoto, Keishi ; Mori, Hiroyuki - p. 485-490 , 2019
Link: https://doi.org/10.1109/..
 
?
12

Micro Structure Observation and Reliability Behavior of Per..:

Orii, Yasumitsu ; Toriyama, Kazushige ; Kohara, Sayuri...
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 73-86 , 2011
Link: https://doi.org/10.5104/..
 
?
13

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
Link: https://doi.org/10.1088/..
 
?
14

4.1: A 20‐inch OLED Display Driven by Super‐Amorphous‐Silic..:

Tsujimura, Takatoshi ; Kobayashi, Yoshinao ; Murayama, Kohji...
SID Symposium Digest of Technical Papers.  34 (2003)  1 - p. 6-9 , 2003
Link: https://doi.org/10.1889/..
 
?
15

Evaluation of the "shelf life" of nitrocellulose membranes ..:

Silva, Luciane Regina Franciscone ; Kamikawa, Camila Mika ; Passos, Angela Noronha..
https://periodicos.saude.sp.gov.br/RIAL/article/view/33536/32368.  , 2017
Link: https://periodicos.saude..
 
1-15