E-LIB Suche - Ergebnisse für: Kripesh, Vaidyanathan

1

Board level solder joint reliability analysis of a fine pit..:

Zhang, Xiaowu ; Kripesh, Vaidyanathan ; Chai, T.C...
Microelectronics Reliability. 48 (2008) 4 - p. 602-610 , 2008

Link: https://doi.org/10.1016/..

2

Fabrication of patterned and non-patterned metallic nanowir..:

Sharma, Gaurav ; Chong, Ser Choong ; Ebin, Liao...
Thin Solid Films. 515 (2007) 7-8 - p. 3315-3322 , 2007

Link: https://doi.org/10.1016/..

3

Synthesis and characterization of patterned and nonpatterne..:

Sharma, Gaurav ; Kripesh, Vaidyanathan ; Sim, Mong Chea.
Sensors and Actuators A: Physical. 139 (2007) 1-2 - p. 272-280 , 2007

Link: https://doi.org/10.1016/..

4

A thick photoresist process for advanced wafer level packag..:

Rao, Vempati Srinivasa ; Kripesh, Vaidyanathan ; Yoon, Seung Wook.
Journal of Micromechanics and Microengineering. 16 (2006) 9 - p. 1841-1846 , 2006

Link: https://doi.org/10.1088/..

5

Electromigration in flip chip solder joints having a thick ..:

Nah, Jae-Woong ; Suh, J. O. ; Tu, K. N....
Journal of Applied Physics. 100 (2006) 12 - p. , 2006

Link: https://doi.org/10.1063/..

6

Under bump metallurgy study on copper/low-k dielectrics for..:

Yoon, Seung Wook ; Kripesh, Vaidyanathan ; Jeffery, Su Young Ji.
Journal of Electronic Materials. 33 (2004) 10 - p. 1144-1155 , 2004

Link: https://doi.org/10.1007/..

7

Reliability of Wire Bonding on Low-k Dielectric Material in..:

Sivakumar, Mohandass ; Kripesh, Vaidyanathan ; Ser Choong, Chong..
Microelectronics Reliability. 42 (2002) 9-11 - p. 1535-1540 , 2002

Link: https://doi.org/10.1016/..

8

Thermo-mechanical actuator-based miniature tagging module f..:

Chandrappan, Jayakrishnan ; Ruiqi, Lim ; Su, Nandar..
Journal of Micromechanics and Microengineering. 21 (2011) 4 - p. 045037 , 2011

Link: https://doi.org/10.1088/..

9

Development of radio-opaque silicon micro needles for medic..:

, In: 2010 12th Electronics Packaging Technology Conference,

Lim, Ruiqi ; Nandar, Su ; Chandrappan, Jayakrishnan... - p. 84-88 , 2010

Link: https://doi.org/10.1109/..

10

Design, assembly and reliability of large die and fine-pitc..:

Ong, Yue Ying ; Ho, Soon Wee ; Vaidyanathan, Kripesh...
Microelectronics Reliability. 50 (2010) 7 - p. 986-994 , 2010

Link: https://doi.org/10.1016/..

11

Underfill selection methodology for fine pitch Cu/low-k FCB..:

Ong, Xuefen ; Ho, Soon Wee ; Ong, Yue Ying...
Microelectronics Reliability. 49 (2009) 2 - p. 150-162 , 2009

Link: https://doi.org/10.1016/..

12

Large scale microcomponents assembly using an external magn..:

Ramadan, Qasem ; Uk, Yoon Seung ; Vaidyanathan, Kripesh
Applied Physics Letters. 90 (2007) 17 - p. , 2007

Link: https://doi.org/10.1063/..

13

A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,

Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007

Link: https://doi.org/10.1109/..