E-LIB Suche - Ergebnisse für: Krishtab, Mikhail

1

Inorganic capping layers in advanced photosensitive polymer..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Pinho, Nelson ; Chery, Emmanuel ; Bhatia, Ritwik... - p. 2040-2045 , 2023

Link: https://doi.org/10.1109/..

2

Porosimetry for Thin Films of Metal–Organic Frameworks: A C..:

Stassin, Timothée ; Verbeke, Rhea ; Cruz, Alexander John...
Advanced Materials. 33 (2021) 17 - p. , 2021

Link: https://doi.org/10.1002/..

3

Cyclic Plasma Halogenation of Amorphous Carbon for Defect-F..:

Krishtab, Mikhail ; Armini, Silvia ; Meersschaut, Johan..
ACS Applied Materials & Interfaces. 13 (2021) 27 - p. 32381-32392 , 2021

Link: https://doi.org/10.1021/..

4

Porosimetry: Porosimetry for Thin Films of Metal–Organic Fr..:

Stassin, Timothée ; Verbeke, Rhea ; Cruz, Alexander John...
Advanced Materials. 33 (2021) 17 - p. , 2021

Link: https://doi.org/10.1002/..

5

Area-selective Ru ALD by amorphous carbon modification usin..:

Zyulkov, Ivan ; Voronina, Ekaterina ; Krishtab, Mikhail...
Materials Advances. 1 (2020) 8 - p. 3049-3057 , 2020

Link: https://doi.org/10.1039/..

6

Integrated Cleanroom Process for the Vapor-Phase Deposition..:

Cruz, Alexander John ; Stassen, Ivo ; Krishtab, Mikhail...
Chemistry of Materials. 31 (2019) 22 - p. 9462-9471 , 2019

Link: https://doi.org/10.1021/..

7

Vapor-deposited zeolitic imidazolate frameworks as gap-fill..:

Krishtab, Mikhail ; Stassen, Ivo ; Stassin, Timothée...
Nature Communications. 10 (2019) 1 - p. , 2019

Link: https://doi.org/10.1038/..

8

Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bott..:

Zyulkov, Ivan ; Krishtab, Mikhail ; De Gendt, Stefan.
ACS Applied Materials & Interfaces. 9 (2017) 36 - p. 31031-31041 , 2017

Link: https://doi.org/10.1021/..

9

Surface-confined activation of ultra low-k dielectrics in C..:

Sun, Yiting ; Krishtab, Mikhail ; Mankelevich, Yuri...
Applied Physics Letters. 108 (2016) 26 - p. , 2016

Link: https://doi.org/10.1063/..

10

Advanced PECVD SiCOH low-k films with low dielectric consta..:

Verdonck, Patrick ; Wang, Cong ; Le, Quoc Toan...
Microelectronic Engineering. 120 (2014) - p. 225-229 , 2014

Link: https://doi.org/10.1016/..

11

Modification of Ultra Low-k Dielectric Films by O2and CO2Pl..:

Olawumi, Teju Tunde ; Levrau, Elisabeth ; Krishtab, Mikhail...
ECS Journal of Solid State Science and Technology. 4 (2014) 1 - p. N3048-N3057 , 2014

Link: https://doi.org/10.1149/..

12

Impact of Plasma Pretreatment and Pore Size on the Sealing ..:

Sun, Yiting ; Krishtab, Mikhail ; Struyf, Herbert...
Langmuir. 30 (2014) 13 - p. 3832-3844 , 2014

Link: https://doi.org/10.1021/..

13

Pore sealing of k 2.0 dielectrics assisted by self-assemble..:

Armini, Silvia ; Prado, Jana Loyo ; Krishtab, Mikhail...
Microelectronic Engineering. 120 (2014) - p. 240-245 , 2014

Link: https://doi.org/10.1016/..

14

Study of Chemical Vapor Deposition of Manganese on Porous S..:

Jourdan, Nicolas ; Krishtab, Mikhail B. ; Baklanov, Mikhail R....
Electrochemical and Solid-State Letters. 15 (2012) 5 - p. H176 , 2012

Link: https://doi.org/10.1149/..

15

Integrated cleanroom process for the vapor-phase deposition..:

Cruz, Alexander John ; Stassen, Ivo ; Krishtab, Mikhail...
Chemistry of Materials, 2019, vol. 31, num. 22, p. 9462-9471. , 2019

Link: https://hdl.handle.net/1..