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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Impact of Through Glass Vias Filling on the Performance of ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
High Density Thin Film Flex Technology for Advanced Packagi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
6
Cap Fabrication and Transfer Bonding Technology for Hermeti..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
7
Reliabillity of Through Glass Vias and hermetically sealing..:
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2019 International Wafer Level Packaging Conference (IWLPC) ,
8
High Density Flex and Thin Chip Embedding Technology for Po..:
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2019 49th European Microwave Conference (EuMC) ,
9