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Krohnert, Kevin
24  Ergebnisse:
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1

RF Glass Technology Is Going Mainstream: Review and Future ..:

Chaloun, Tobias ; Brandl, Susanne ; Ambrosius, Norbert...
IEEE Journal of Microwaves.  3 (2023)  2 - p. 783-799 , 2023
Link: https://doi.org/10.1109/..
 
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2

MMIC-to-Dielectric Waveguide Transitions for Glass Packages..:

Galler, Thomas ; Chaloun, Tobias ; Mayer, Winfried...
IEEE Transactions on Microwave Theory and Techniques.  71 (2023)  7 - p. 2807-2817 , 2023
Link: https://doi.org/10.1109/..
 
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3

Impact of Through Glass Vias Filling on the Performance of ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Gupta, Parnika ; Morrissey, Padraic E. ; O' Brien, Peter... - p. 391-397 , 2022
Link: https://doi.org/10.1109/..
 
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4

Glass Package for Radar MMICs Above 150 GHz:

Galler, Thomas ; Chaloun, Tobias ; Mayer, Winfried...
IEEE Journal of Microwaves.  2 (2022)  1 - p. 97-107 , 2022
Link: https://doi.org/10.1109/..
 
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5

High Density Thin Film Flex Technology for Advanced Packagi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Oppermann, Hermann ; Wohrmann, Markus... - p. 1010-1018 , 2022
Link: https://doi.org/10.1109/..
 
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6

Cap Fabrication and Transfer Bonding Technology for Hermeti..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Mackowiak, Piotr ; Krohnert, Kevin... - p. 432-438 , 2020
Link: https://doi.org/10.1109/..
 
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7

Reliabillity of Through Glass Vias and hermetically sealing..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Krohnert, Kevin ; Friedrich, Georg ; Starukhin, Dzmitry... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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8

High Density Flex and Thin Chip Embedding Technology for Po..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),
Zoschke, Kai ; Mackowiak, Piotr ; Ngo, Ha-Duong... - p. 1-9 , 2019
Link: https://doi.org/10.23919..
 
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9

Hermetically Sealed Glass Package for Highly Integrated MMI..:

, In: 2019 49th European Microwave Conference (EuMC),
Galler, Thomas ; Chaloun, Tobias ; Krohnert, Kevin.. - p. 292-295 , 2019
Link: https://doi.org/10.23919..
 
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10

A WSi–WSiN–Pt Metallization Scheme for Silicon Carbide-Base..:

Ngo, Ha-Duong ; Mukhopadhyay, Biswajit ; Mackowiak, Piotr...
Micromachines.  7 (2016)  10 - p. 193 , 2016
Link: https://doi.org/10.3390/..
 
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11

RF Glass Technology Is Going Mainstream: Review and Future ..:

Chaloun, Tobias ; Brandl, Susanne ; Ambrosius, Norbert...
http://dx.doi.org/10.18725/OPARU-50955.  , 2023
Link: https://doi.org/10.18725..
 
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12

Glass package for radar MMICs above 150 GHz:

Galler, Thomas ; Chaloun, Tobias ; Mayer, Winfried...
http://dx.doi.org/10.18725/OPARU-40304.  , 2021
Link: https://doi.org/10.18725..
 
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13

A WSi–WSiN–Pt Metallization Scheme for Silicon Carbide-Base..:

Ngo, Ha-Duong ; Mukhopadhyay, Biswajit ; Mackowiak, Piotr...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190469/.  , 2016
Link: http://www.ncbi.nlm.nih...
 
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14

RF Glass Technology Is Going Mainstream: Review and Future ..:

Tobias Chaloun ; Susanne Brandl ; Norbert Ambrosius...
https://ieeexplore.ieee.org/document/10091719/.  , 2023
Link: https://doi.org/10.1109/..
 
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15

Glass Package for Radar MMICs Above 150 GHz:

Thomas Galler ; Tobias Chaloun ; Winfried Mayer...
https://ieeexplore.ieee.org/document/9615214/.  , 2022
Link: https://doi.org/10.1109/..
 
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