Kuah, Y.C.
38  Ergebnisse:
Personensuche X
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2

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
 
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3

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
 
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4

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
 
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6

Surrogate Rehabilitative Time Series Data for Image-based D..:

, In: 2019 27th European Signal Processing Conference (EUSIPCO),
 
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7

Clinical and kinematic evaluation of the H-Man arm robot fo..:

Chua, K. ; Kuah, C. ; Ng, C....
Annals of Physical and Rehabilitation Medicine.  61 (2018)  - p. e95 , 2018
 
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8

P33.02: Fetal clavicle length: an Asian nomogram:

Kuah, A. C. ; Lee, S. L. ; Fook-Chong, S...
Ultrasound in Obstetrics and Gynecology.  30 (2007)  4 - p. 578-578 , 2007
 
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9

P10.20: Fetal orbital biometry: a cross‐sectional study:

Kuah, A. C. ; Lee, S. L. ; Fook‐Chong, S...
Ultrasound in Obstetrics & Gynecology.  26 (2005)  4 - p. 444-444 , 2005
 
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11

Comparison of effect of CTG + STan with CTG alone on emerge..:

Kuah, S. ; Simpson, B. ; Salter, A....
Ultrasound in Obstetrics & Gynecology.  62 (2023)  4 - p. 462-470 , 2023
 
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