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Kumar, Mishra Dileep
1197  Ergebnisse:
Personensuche X
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1

Multi-Chip Stacked Memory Module Development using Chip to ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sekhar, Vasarla Nagendra ; Kumar, Mishra Dileep ; Tippabhotla, Sasi Kumar... - p. 2024-2030 , 2024
Link: https://doi.org/10.1109/..
 
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2

Process Challenges in Thin Wafers Fabrication with Double S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kumar, Mishra Dileep ; Nagendra Sekhar, Vasarla ; Rao, B.S.S. Chandra.. - p. 614-619 , 2024
Link: https://doi.org/10.1109/..
 
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3

Dielectric Stack Optimization for Die-level Warpage Reducti..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Rao, B.S.S. Chandra ; Kumar, Mishra Dileep ; Sekhar, Vasarla Nagendra... - p. 62-68 , 2024
Link: https://doi.org/10.1109/..
 
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4

Cu Damascene Process on Temporary Bonded Wafers for Thin Ch..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sekhar, Vasarla Nagendra ; Kumar, Mishra Dileep ; Lianto, Prayudi.. - p. 564-570 , 2023
Link: https://doi.org/10.1109/..
 
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5

Evaluation of Low Temperature Inorganic Dielectric Material..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kumar, Mishra Dileep ; Nagendra Sekhar, Vasarla ; Choong, Chong Ser... - p. 354-358 , 2023
Link: https://doi.org/10.1109/..
 
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6

Etching of micro-channels in fused quartz for novel device ..:

Shetty, Shubhava ; Kumar Mishra, Dileep ; Dixit, Pradeep...
Materials Today: Proceedings.  , 2023
Link: https://doi.org/10.1016/..
 
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7

Reliability Assessment of 2.5D Module using Chip to Wafer H..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chong, Ser Choong ; Au Keng Yuen, Jason ; Sekhar, Vasarla Nagendra... - p. 425-429 , 2023
Link: https://doi.org/10.1109/..
 
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8

Process Development and Integration on Si Substrate for Ion..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Li, H. Y. ; Liu Huihong, Clarence ; Jaafar, Norhanani... - p. 253-256 , 2023
Link: https://doi.org/10.1109/..
 
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9

Polymer Dielectric Materials Evaluation for Hybrid Bonding ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sekhar, Vasarla Nagendra ; Fujiwara, Takenori ; Araki, Hitoshi... - p. 216-220 , 2023
Link: https://doi.org/10.1109/..
 
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10

Fabrication of Through-glass Vias (TGV) based 3D microstruc..:

Kant Bajpai, Vishnu ; Kumar Mishra, Dileep ; Dixit, Pradeep
Applied Surface Science.  584 (2022)  - p. 152494 , 2022
Link: https://doi.org/10.1016/..
 
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11

Multi-Response Optimization during Electro-Discharge Machin..:

Rahul ; Srivastava, Ankur ; Kumar Mishra, Dileep...
Materials Today: Proceedings.  5 (2018)  2 - p. 4269-4276 , 2018
Link: https://doi.org/10.1016/..
 
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12

Effect of pulse frequency and duty cycle on electrochemical..:

Singh, Tarlochan ; Mishra, Dileep Kumar ; Dixit, Pradeep
Journal of Applied Electrochemistry.  52 (2022)  4 - p. 667-682 , 2022
Link: https://doi.org/10.1007/..
 
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13

Evaluation of Polymer Materials for Hybrid Bonding Applicat..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mishra, Dileep Kumar ; Sekhar, V. N. ; Choong, Chong Ser. - p. 357-360 , 2022
Link: https://doi.org/10.1109/..
 
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14

Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sekhar, V. N. ; Mishra, Dileep Kumar ; Choong, Chong Ser. - p. 589-593 , 2022
Link: https://doi.org/10.1109/..
 
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15

Fabrication of 3D microstructures in glass by direct writin..:

Mishra, Dileep Kumar ; Dixit, Pradeep
Materials and Manufacturing Processes.  38 (2022)  8 - p. 999-1008 , 2022
Link: https://doi.org/10.1080/..
 
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