Kuo, Gordon
234  Ergebnisse:
Personensuche X
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1

A Thermally Friendly Bonding Scheme for 3D System Integrati..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Gordon ; Chen, Chih-Yuan ; Hsieh, Cheng-Chieh... - p. 1973-1976 , 2023
 
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Human capital requirements in Singapore's international fin..:

Tan, Gordon Kuo Siong
Singapore Journal of Tropical Geography.  44 (2023)  3 - p. 539-554 , 2023
 
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Buy what you want, today! Platform ecologies of 'buy now, p..:

Tan, Gordon Kuo Siong
Transactions of the Institute of British Geographers.  47 (2022)  4 - p. 912-926 , 2022
 
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Democratizing finance with Robinhood: Financial infrastruct..:

Tan, Gordon Kuo Siong
Environment and Planning A: Economy and Space.  53 (2021)  8 - p. 1862-1878 , 2021
 
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Assembling sustainability reporting in Singapore:

Tan, Gordon Kuo Siong
Competition & Change.  26 (2021)  5 - p. 629-649 , 2021
 
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