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X
Kuo, Mingtzung
5  Ergebnisse:
Personensuche X
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1

Electroplating Uniformity Enhancement for High Performance ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chiang, Yuan-Feng ; Wu, Boyin ; Kuo, Mingtzung.. - p. 63-64 , 2023
Link: https://doi.org/10.23919..
 
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2

An Effective Uniformity Improvement For Fan-Out Panel Level..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liao, Chin-Ting ; Wu, Boyin ; Kuo, Mingtzung... - p. 38-41 , 2023
Link: https://doi.org/10.1109/..
 
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3

Firewall Design for High Quality Electroplating Redistribut..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wu, Boyin ; Kuo, Mingtzung ; Chiang, Yuan-Feng.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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4

Tailoring Pigment Dispersants with Polyisobutylene Twin-Tai..:

Lee, Patricia T.C. ; Chiu, Chih-Wei ; Chang, Ling-Yu...
ACS Applied Materials & Interfaces.  6 (2014)  16 - p. 14345-14352 , 2014
Link: https://doi.org/10.1021/..
 
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5

First Fabrication of Electrowetting Display by Using Pigmen..:

Lee, Patricia T.C. ; Chiu, Chih-Wei ; Lee, Tzong-Ming...
ACS Applied Materials & Interfaces.  5 (2013)  13 - p. 5914-5920 , 2013
Link: https://doi.org/10.1021/..
 
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