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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
1
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusi..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
3
Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature ..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
5