Kuziora, Stephane Leonard
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Ag–(In–Bi) solid-state bonding:

Kuziora, Stéphane Léonard ; Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif
Journal of Materials Science: Materials in Electronics.  34 (2023)  16 - p. , 2023
 
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Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
 
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Bi Behaviour in Au–(In–Bi) SLID Bonding:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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Impact of High Pressures on Au-Sn Solid Liquid Interdiffusi..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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