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Kwon, Youngsu
138  Ergebnisse:
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1

The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yoon, Jiwon ; Kwon, Youngsu ; Kim, Hyunwoo... - p. 1687-1693 , 2024
Link: https://doi.org/10.1109/..
 
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2

Design and Analysis of Redistribution Layer Interposer Chan..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Yoon, Jiwon ; Park, Hyunwook ; Kim, Hyunwoo... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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3

Chiplet Heterogeneous-Integration AI Processor:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
Kwon, Youngsu ; Han, Jinho ; Cho, Yongcheol Peter... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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4

DQ and DQS Receiver for HBM3 Memory Interface with DFE Offs..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Park, Sujin ; Jeon, Young-Deuk ; Kim, Yi-Gyeong... - p. 215-216 , 2023
Link: https://doi.org/10.1109/..
 
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5

ABSX: The Chiplet Hyperscale AI Processing Unit for Energy-..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Kwon, Youngsu - p. 217-218 , 2023
Link: https://doi.org/10.1109/..
 
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6

2.5D Large-Scale Interposer Bonding Process Verification us..:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
Park, Sujin ; Kim, Yi-Gyeong ; Jeon, Young-Deuk... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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7

Multi-Stripline Redistribution Layer Interposer Channel Des..:

, In: 2023 20th International SoC Design Conference (ISOCC),
Yoon, Jiwon ; Kim, Hyunwoo ; Sim, Boogyo... - p. 247-248 , 2023
Link: https://doi.org/10.1109/..
 
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8

M3FPU: Multiformat Matrix Multiplication FPU Architectures ..:

, In: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Jeon, Won ; Cho, Yong Cheol Peter ; Kim, Hyun Mi... - p. 150-153 , 2022
Link: https://doi.org/10.1109/..
 
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9

AIWareK: Compiling PyTorch Model for AI Processor Using MLI..:

, In: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Kwon, Hyunjeong ; Kim, Hyun Mi ; Lyuh, Chun-Gi... - p. 463-465 , 2022
Link: https://doi.org/10.1109/..
 
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10

ArtBrain-K: AI Processor based-on 5-PetaFLOPS AI Server Sys..:

, In: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Han, Jinho ; Lyuh, Chun-Gi ; Shin, Kyeongsun... - p. 466-468 , 2022
Link: https://doi.org/10.1109/..
 
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11

Backward Graph Construction and Lowering in DL Compiler for..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Kwon, Hyunjeong ; Kwon, Youngsu ; Han, Jinho - p. 91-92 , 2022
Link: https://doi.org/10.1109/..
 
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12

Multiplexed proteomics of autophagy-deficient murine macrop..:

Maculins, Timurs ; Verschueren, Erik ; Hinkle, Trent...
eLife.  10 (2021)  - p. , 2021
Link: https://doi.org/10.7554/..
 
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13

HPC LINPACK Parameter Optimization on Homo-/Heterogeneous S..:

, In: The International Conference on High Performance Computing in Asia-Pacific Region,
Ham, Je-Seok ; Peter Cho, Yong Cheol ; Kim, Ju-Yeob... - p. 139-143 , 2021
Link: https://dl.acm.org/doi/1..
 
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14

CD96 functions as a co‐stimulatory receptor to enhance CD8+..:

Chiang, Eugene Y. ; de Almeida, Patricia E. ; de Almeida Nagata, Denise E....
European Journal of Immunology.  50 (2020)  6 - p. 891-902 , 2020
Link: https://doi.org/10.1002/..
 
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15

AI 32TFLOPS Autonomous Driving Processor on AI-Ware with Ad..:

, In: 2019 International SoC Design Conference (ISOCC),
Kwon, Youngsu ; Cho, Yongcheol Peter ; Yang, Jeongmin... - p. 174-175 , 2019
Link: https://doi.org/10.1109/..
 
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