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Labie, Riet
18  Ergebnisse:
Personensuche X
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1

BGA electromigration behavior and why it has become the bot..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Labie, Riet ; Nawghane, Chinmay ; Tsiakos, Dimitrios... - p. 678-684 , 2024
Link: https://doi.org/10.1109/..
 
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2

Measurement and Simulation of Mechanical Strength of Back-E..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Vandevelde, Bart ; Cox, Kevin ; Moloudi, Reza... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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3

Strain Measurements and Thermo-Mechanical Simulation of SnA..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Vandevelde, Bart ; Labie, Riet ; Lauwaert, Ralph... - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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4

A PoF based methodology to assess the reliability of a sens..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Nawghane, Chinmay ; Vandevelde, Bart ; Labie, Riet... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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5

Molecular detection of SARS-COV-2 in exhaled breath at the ..:

Stakenborg, Tim ; Raymenants, Joren ; Taher, Ahmed...
Biosensors and Bioelectronics.  217 (2022)  - p. 114663 , 2022
Link: https://doi.org/10.1016/..
 
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6

Impact of PCB-housing-interaction on QFN solder joint relia..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Vandevelde, Bart ; Labie, Riet ; Vanderstraeten, Daniel. - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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7

Electrically Active Defects in Plated Crystalline Silicon n..:

Simoen, Eddy Roger ; Dang, Chi ; Labie, Riet.
ECS Transactions.  86 (2018)  10 - p. 137-146 , 2018
Link: https://doi.org/10.1149/..
 
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8

Insights into the reliability of Ni/Cu plated p-PERC silico..:

Dang, Chi ; Labie, Riet ; Simoen, Eddy...
Energy Procedia.  124 (2017)  - p. 862-868 , 2017
Link: https://doi.org/10.1016/..
 
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9

Four-point bending cycling: The alternative for thermal cyc..:

Vandevelde, Bart ; Vanhee, Filip ; Pissoort, Davy...
Microelectronics Reliability.  74 (2017)  - p. 131-135 , 2017
Link: https://doi.org/10.1016/..
 
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10

Resistance and passivation of metal contacts using n-type a..:

Labie, Riet ; Bearda, Twan ; El Daif, Ounsi...
Journal of Applied Physics.  115 (2014)  18 - p. , 2014
Link: https://doi.org/10.1063/..
 
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11

Large-area Hybrid Silicon Heterojunction Solar Cells with N..:

Tous, Loic ; Granata, Stefano Nicola ; Rouhi, Alireza...
Energy Procedia.  55 (2014)  - p. 715-723 , 2014
Link: https://doi.org/10.1016/..
 
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12

Investigation of Laser Ablation Induced Defects in Crystall..:

Dang, Chi ; Labie, Riet ; Tous, Loic...
Energy Procedia.  55 (2014)  - p. 649-655 , 2014
Link: https://doi.org/10.1016/..
 
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13

Crystalline thin‐foil silicon solar cells: where crystallin..:

Dross, Frederic ; Baert, Kris ; Bearda, Twan...
Progress in Photovoltaics: Research and Applications.  20 (2012)  6 - p. 770-784 , 2012
Link: https://doi.org/10.1002/..
 
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14

Impact of the electrodeposition chemistry used for TSV fill..:

Okoro, Chukwudi ; Labie, Riet ; Vanstreels, Kris...
Journal of Materials Science.  46 (2011)  11 - p. 3868-3882 , 2011
Link: https://doi.org/10.1007/..
 
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15

The Impact of Back-Side Cu Contamination on 3D Stacking Arc..:

Yang, Yu ; Labie, Riet ; Richard, Olivier...
Electrochemical and Solid-State Letters.  13 (2010)  2 - p. H39 , 2010
Link: https://doi.org/10.1149/..
 
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