Lan, Shuhuai
23  Ergebnisse:
Personensuche X
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2

Performance evaluation of commercial-size proton exchange m..:

Huang, Fuxiang ; Qiu, Diankai ; Lan, Shuhuai..
Energy Conversion and Management.  203 (2020)  - p. 112256 , 2020
 
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3

An integrated model of the water transport in nonuniform co..:

Xu, Yifan ; Qiu, Diankai ; Yi, Peiyun..
International Journal of Hydrogen Energy.  44 (2019)  26 - p. 13777-13785 , 2019
 
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5

Microstructural evolution during friction stir welding of d..:

Lan, Shuhuai ; Liu, Xun ; Ni, Jun
The International Journal of Advanced Manufacturing Technology.  82 (2015)  9-12 - p. 2183-2193 , 2015
 
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6

Modeling and experimental investigation of gas film in micr..:

Jiang, Baoyang ; Lan, Shuhuai ; Wilt, Kevin.
International Journal of Machine Tools and Manufacture.  90 (2015)  - p. 8-15 , 2015
 
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7

A new geometric error modeling approach for multi-axis syst..:

Tang, Hao ; Duan, Ji-an ; Lan, Shuhuai.
International Journal of Machine Tools and Manufacture.  92 (2015)  - p. 41-51 , 2015
 
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8

Electrically assisted friction stir welding for joining Al ..:

Liu, Xun ; Lan, Shuhuai ; Ni, Jun
Journal of Materials Processing Technology.  219 (2015)  - p. 112-123 , 2015
 
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9

A review on spindle thermal error compensation in machine t..:

Li, Yang ; Zhao, Wanhua ; Lan, Shuhuai...
International Journal of Machine Tools and Manufacture.  95 (2015)  - p. 20-38 , 2015
 
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10

Experimental investigation of spark generation in electroch..:

Jiang, Baoyang ; Lan, Shuhuai ; Ni, Jun.
Journal of Materials Processing Technology.  214 (2014)  4 - p. 892-898 , 2014
 
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12

Experimental study of Electro-Plastic Effect on Advanced Hi..:

Liu, Xun ; Lan, Shuhuai ; Ni, Jun
Materials Science and Engineering: A.  582 (2013)  - p. 211-218 , 2013
 
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13

Continuous roll-to-flat thermal imprinting process for larg..:

Lan, Shuhuai ; Song, Jung-Han ; Lee, Moon G....
Microelectronic Engineering.  87 (2010)  12 - p. 2596-2601 , 2010
 
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15

A parameter study on the micro hot-embossing process of gla..:

Lan, Shuhuai ; Lee, Hye-Jin ; Kim, EunHee...
Microelectronic Engineering.  86 (2009)  12 - p. 2369-2374 , 2009
 
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