Lau, Chun-Sean
1686  Ergebnisse:
Personensuche X
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1

Board-level Solder Joint Reliability of QFN Packages with E..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lau, Chun-Sean ; Hilmi, Ahmad Faridzul ; Ye, Ning. - p. 1482-1488 , 2022
 
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2

A Numerical Technique to Evaluate Warpage Behavior of Doubl..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, Chun-Sean ; Tan, Yi Chun ; Kuai Le, Choon. - p. 554-560 , 2020
 
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7

Thermo-mechanical challenges of reflowed lead-free solder j..:

Lau, Chun Sean ; Khor, C.Y. ; Soares, D...
Soldering & Surface Mount Technology.  28 (2016)  2 - p. 41-62 , 2016
 
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8

FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOME..:

CHUN-SEAN LAU ; M. Z. ABDULLAH ; M. ABDUL MUJEEBU.
http://jestec.taylors.edu.my/Vol%209%20Issue%201%20February%2014/Volume%20(9)%20Issue%20(1)%20047-063.pdf.  , 2014
 
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9

Contributors:

, In: Advanced Nanomaterials for Membrane Synthesis and its Applications,
 
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10

Discovery of Trifluoromethyl(pyrimidin-2-yl)azetidine-2-car..:

Phillips, Dean P. ; Gao, Wenqi ; Yang, Yang...
Journal of Medicinal Chemistry.  57 (2014)  8 - p. 3263-3282 , 2014
 
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14

Tailoring the permeability and flux stability of forward os..:

Lee, Wei Jie ; Goh, Pei Sean ; Lau, Woei Jye...
Journal of Environmental Chemical Engineering.  10 (2022)  3 - p. 107977 , 2022
 
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