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Lau, John H.
9680  Ergebnisse:
Personensuche X
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1

Flip Chip Technology:

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 1-101 , 2024
Link: https://doi.org/10.1007/..
 
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2

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology:

Lau, John H - 1st ed. 2024 . , 2024
Link: https://doi.org/10.1007/..
 
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3

Cu-Cu Hybrid Bonding:

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 103-161 , 2024
Link: https://doi.org/10.1007/..
 
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4

Fan-Out Technology:

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 233-425 , 2024
Link: https://doi.org/10.1007/..
 
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5

Co-packaged Optics:

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 471-493 , 2024
Link: https://doi.org/10.1007/..
 
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6

State of the Art of Cu–Cu Hybrid Bonding:

Lau, John H.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 376-396 , 2024
Link: https://doi.org/10.1109/..
 
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7

Chiplet Communications (Bridges):

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 427-469 , 2024
Link: https://doi.org/10.1007/..
 
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8

Fan-In Technology:

, In: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology,
Lau, John H. - p. 163-232 , 2024
Link: https://doi.org/10.1007/..
 
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9

Reliability of Heterogeneous Integration on Hybrid Substrat..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yang, Channing Cheng-Lin ; Lau, John H ; Peng, Andy Yan-Jia... - p. 542-547 , 2023
Link: https://doi.org/10.1109/..
 
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10

Chiplet Design and Heterogeneous Integration Packaging:

Lau, John H - 1st ed. 2023 . , 2023
Link: https://doi.org/10.1007/..
 
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11

Hybrid Substrate With Ultralarge Organic Interposer for Het..:

Lau, John H. ; Lin, Curry ; Liu, Hsing-Ning...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1371-1379 , 2023
Link: https://doi.org/10.1109/..
 
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12

Chip Partition Heterogeneous Integration and Chip Split Het..:

, In: Chiplet Design and Heterogeneous Integration Packaging,
Lau, John H. - p. 101-136 , 2023
Link: https://doi.org/10.1007/..
 
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13

State-Of-The-Art of Advanced Packaging:

, In: Chiplet Design and Heterogeneous Integration Packaging,
Lau, John H. - p. 1-99 , 2023
Link: https://doi.org/10.1007/..
 
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14

Chiplets Lateral Communications:

, In: Chiplet Design and Heterogeneous Integration Packaging,
Lau, John H. - p. 381-429 , 2023
Link: https://doi.org/10.1007/..
 
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15

Multiple System and Heterogeneous Integration with TSV-Less..:

, In: Chiplet Design and Heterogeneous Integration Packaging,
Lau, John H. - p. 271-380 , 2023
Link: https://doi.org/10.1007/..
 
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