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X
Le, Fred Fuliang
3  Ergebnisse:
Personensuche X
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1

Reflow Soldering Using Flux-sprayed Solder Preforms:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Le, Fred Fuliang ; Guan, Zunyu ; Chen, Haibin.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Die Tilt Improvement Through Copper Spacers in Solder Paste..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Santican, Haima ; Dchar, Ilyas ; Yandoc, Ding.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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3

Thermal Stability Characterization of High-Temperature Sold..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Le, Fred Fuliang ; Guan, Zunyu ; Chen, Haibin.. - p. 580-584 , 2022
Link: https://doi.org/10.1109/..
 
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