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Lee, Chang-Chi
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1

Using a Flexible IoT Architecture and Sequential AI Model t..:

Yuan, Cadmus ; Wang, Chic-Chang ; Chang, Ming-Lun...
Electronics.  10 (2021)  20 - p. 2540 , 2021
Link: https://doi.org/10.3390/..
 
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2

Solder joint reliability risk estimation by AI modeling:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Yuan, Cadmus ; Lee, Chang-Chi - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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3

A High-Precision Bandgap Reference With a V-Curve Correctio..:

Lee, Chang-Chi ; Chen, Hou-Ming ; Lu, Chi-Chang...
IEEE Access.  8 (2020)  - p. 62632-62638 , 2020
Link: https://doi.org/10.1109/..
 
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4

Solder Joint Reliability Modeling by Sequential Artificial ..:

Yuan, Cadmus C. A. ; Lee, Chang-Chi
IEEE Access.  8 (2020)  - p. 143494-143501 , 2020
Link: https://doi.org/10.1109/..
 
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5

Lifetime study for solution processed organic light emittin..:

Juang, Fuh-Shyang ; Lee, Chang-Chi ; Chen, Jeng-Yue..
IOP Conference Series: Materials Science and Engineering.  600 (2019)  1 - p. 012018 , 2019
Link: https://doi.org/10.1088/..
 
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6

Pesticide Residue Testing System for Fruits and Vegetables ..:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),
Lee, Chang-Chi ; Liu, Yu-Sung ; Tseng, Chun-Hsiang... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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7

The physics of Cu pillar bump interconnect under electromig..:

, In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC),
Hsiao, Yu-Hsiang ; Chen, Chien-Fan ; Yang, Ping-Feng... - p. 1-6 , 2014
Link: https://doi.org/10.1109/..
 
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8

Study of factors affecting warpage of HFCBGA subjected to r..:

Wang, Tong Hong ; Tsai, Ching-I ; Lee, Chang-Chi.
Microelectronics Reliability.  53 (2013)  2 - p. 297-302 , 2013
Link: https://doi.org/10.1016/..
 
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9

Structural design guideline to minimize extreme low-k delam..:

Lai, Yi-Shao ; Shih, Meng-Kai ; Lee, Chang-Chi.
Microelectronics Reliability.  52 (2012)  11 - p. 2851-2855 , 2012
Link: https://doi.org/10.1016/..
 
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10

Effect of surface roughness of silicon die and copper heat ..:

Wang, Tong Hong ; Paisner, Sara N. ; Lee, Chang-Chi..
Microelectronics Reliability.  51 (2011)  8 - p. 1372-1376 , 2011
Link: https://doi.org/10.1016/..
 
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11

High-powered thermal gel degradation evaluation on board-le..:

Wang, Tong Hong ; Chen, Hsuan-Yu ; Lee, Chang-Chi.
Microelectronic Engineering.  88 (2011)  10 - p. 3101-3107 , 2011
Link: https://doi.org/10.1016/..
 
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12

Thermal characteristics evaluation for board-level high per..:

Wang, Tong Hong ; Lee, Chang-Chi ; Lai, Yi-Shao
Microelectronic Engineering.  87 (2010)  12 - p. 2463-2467 , 2010
Link: https://doi.org/10.1016/..
 
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13

On the thermal stability margins of high-leakage current pa..:

, In: 2006 8th Electronics Packaging Technology Conference,
Lee, Chang-chi ; de Groot, Johannes - p. None , 2006
Link: https://doi.org/10.1109/..
 
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14

The gene for a human microfibril-associated glycoprotein is..:

Zhao, Zhaoyang ; Lee, Chang-Chi ; Jiralerspong, Sarn...
Human Molecular Genetics.  4 (1995)  4 - p. 589-597 , 1995
Link: https://doi.org/10.1093/..
 
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15

LC4SV: A Denoising Framework Learning to Compensate for Uns..:

, In: 2023 IEEE Automatic Speech Recognition and Understanding Workshop (ASRU),
Lee, Chi-Chang ; Chen, Hong-Wei ; Chen, Chu-Song... - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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