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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
10
A hybrid bonding interconnection with a novel low-temperatu..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
15