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Lee, Jam Wem
17  Ergebnisse:
Personensuche X
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1

Electrostatic Discharge Protection under Pad Design for Cop..:

Lee, Jam Wem ; Li, Yiming ; Chao, Alice.
Japanese Journal of Applied Physics.  43 (2004)  4S - p. 2302 , 2004
Link: https://doi.org/10.1143/..
 
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2

Highly Reliable Nickel Silicide Formation with a Zr Capping..:

Lee, Tsung Lin ; Lee, Jam Wem ; Lee, Mei Chi..
Electrochemical and Solid-State Letters.  6 (2003)  5 - p. G66 , 2003
Link: https://doi.org/10.1149/..
 
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3

Thin Oxides Grown on Disilane-Based Polysilicon:

Lee, Jam Wem ; Lei, Tan Fu ; Lee, Chung-Len
Japanese Journal of Applied Physics.  41 (2002)  Part 1, No. 6A - p. 3651-3654 , 2002
Link: https://doi.org/10.1143/..
 
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4

High thermal conductive Graphene-based Composites and its C..:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Lin, Rong-Teng ; Wu, Bi-Xian ; Yang, Yun-Hong... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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5

CMOS Latch-up Improvement: Embedded Active Collector in Fin..:

, In: 2022 44th Annual EOS/ESD Symposium (EOS/ESD),
Huang, Chien-Yao ; Lin, Wun-Jie ; Su, Yu-Ti... - p. 1-6 , 2022
Link: https://doi.org/10.23919..
 
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6

Low-Capacitance, High-CDM ESD Protection Design with FEOL a..:

, In: 2022 44th Annual EOS/ESD Symposium (EOS/ESD),
Chang, Yi-Feng ; Yang, Han-Jen ; Chang, Tzu-Heng.. - p. 1-5 , 2022
Link: https://doi.org/10.23919..
 
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7

ESD protection Diode with Guard Ring Layout Optimized for L..:

, In: 2019 41st Annual EOS/ESD Symposium (EOS/ESD),
Huang, Kai-Ping ; Peng, Po-Lin ; Chu, Li-Wei... - p. 1-4 , 2019
Link: https://doi.org/10.23919..
 
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8

Low-Capacitance SCR for On-Chip ESD Protection with High CD..:

, In: 2019 41st Annual EOS/ESD Symposium (EOS/ESD),
Peng, Po-Lin ; Chu, Li-Wei ; Tsai, Ming-Fu... - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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9

Local Oxidation Fin-Field-Effect-Transistor Structure for N..:

Tai, Ya-Li ; Lee, Jam-Wem ; Lien, Chen-Hsin
Japanese Journal of Applied Physics.  49 (2010)  4R - p. 044301 , 2010
Link: https://doi.org/10.1143/..
 
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10

Investigation of Minority Carrier Distribution in Semicondu..:

Tai, Ya-Li ; Lee, Jam-Wem ; Lien, Chen-Hsin
Japanese Journal of Applied Physics.  48 (2009)  2R - p. 021202 , 2009
Link: https://doi.org/10.1143/..
 
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11

Punchthrough effects on the electrostatic discharge robustn..:

Lee, Jam-Wem ; Tang, Howard
Applied Physics Letters.  89 (2006)  10 - p. , 2006
Link: https://doi.org/10.1063/..
 
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12

Quantum Mechanical Corrected Simulation Program with Integr..:

Li, Yiming ; Yu, Shao-Ming ; Lee, Jam-Wem
Japanese Journal of Applied Physics.  44 (2005)  4S - p. 2132 , 2005
Link: https://doi.org/10.1143/..
 
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13

A three-dimensional simulation of electrostatic characteris..:

Li, Yiming ; Chou, Hung-Mu ; Lee, Jam-Wem.
Microelectronic Engineering.  81 (2005)  2-4 - p. 434-440 , 2005
Link: https://doi.org/10.1016/..
 
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14

Silicon-Germanium Structure in Surrounding-Gate Strained Si..:

Li, Yiming ; Lee, Jam-Wem ; Chou, Hung-Mu
Journal of Computational Electronics.  3 (2004)  3-4 - p. 251-255 , 2004
Link: https://doi.org/10.1007/..
 
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15

Body ballast resistor enhances ESD robustness of deep sub-m..:

Wem Lee, Jam ; Lian Su, Jin ; Tang, Howard
Microelectronics Journal.  35 (2004)  9 - p. 783-788 , 2004
Link: https://doi.org/10.1016/..
 
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