Lee, Jing Rou
314  Ergebnisse:
Personensuche X
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3

Investigation of Thermal Reflow Profile for Copper Pillar T..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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4

Effects of Diameter on Copper Pillar with Solder Cap Interc..:

, In: The Minerals, Metals & Materials Series; TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedings,
 
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5

A review on numerical approach of reflow soldering process ..:

Lee, Jing Rou ; Aziz, Mohd Sharizal Abdul ; Ishak, Mohammad Hafifi Hafiz.
The International Journal of Advanced Manufacturing Technology.  121 (2022)  7-8 - p. 4325-4353 , 2022
 
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7

Efficacy and Safety of Locoregional Radiotherapy With Chemo..:

You, Rui ; Liu, You-Ping ; Huang, Pei-Yu...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7378870/.  , 2020
 
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12

Oxidation of biomass-derived furans to maleic acid over nit..:

Van Nguyen, Chi ; Boo, Jing Rou ; Liu, Chia-Hung...
Catalysis Science & Technology.  10 (2020)  5 - p. 1498-1506 , 2020
 
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13

Characterization of Surface Activation on Nanotwinned Coppe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Rou-Jun ; He, Pin-Syuan ; Chiu, Wei-Lan... - p. 77-78 , 2024
 
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