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Lee, Ning-Cheng
11760  Ergebnisse:
Personensuche X
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1

SIP Solder Paste via Powder Cluster Design Harvest Both Slu..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Zhengfeng ; Wang, Jian ; Lee, Ning-Cheng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Sip Solder Paste with Superior Slump Resistance via Powder ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xu, Zhengfeng ; Zheng, Aixia ; Wang, Jian.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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3

Editorial: Composite solder joints:

Zhang, Shuye ; He, Peng ; Paik, Kyung-Wook..
Journal of Advanced Joining Processes.  6 (2022)  - p. 100126 , 2022
Link: https://doi.org/10.1016/..
 
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4

High-reliability, high-melting, lead-free, mixed solder pas..:

Zhang, HongWen ; Lee, Ning-Cheng
Review of Scientific Instruments.  92 (2021)  9 - p. , 2021
Link: https://doi.org/10.1063/..
 
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5

Anisotropic constitutive model coupled with damage for Sn-r..:

Zhang, Zhao ; Liu, Sheng ; Ma, Kun...
International Journal of Damage Mechanics.  31 (2021)  4 - p. 582-604 , 2021
Link: https://doi.org/10.1177/..
 
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6

Reliability Tests and Data Analyses of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 355-413 , 2020
Link: https://doi.org/10.1007/..
 
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7

Failure Analysis of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 485-520 , 2020
Link: https://doi.org/10.1007/..
 
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8

Assembly and Reliability of Lead-Free Solder Joints:

Lau, John H ; Lee, Ning-Cheng - 1st ed. 2020 . , 2020
Link: https://doi.org/10.1007/..
 
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9

Design for Reliability of Solder Joints:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 415-483 , 2020
Link: https://doi.org/10.1007/..
 
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10

Versatile TIM Solution with Chain Network Solder Composite:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Mao, Runsheng ; Chen, Sihai ; Zito, Elaina.. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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11

Solder Joints in PCB Assembly and Semiconductor Packaging:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 1-62 , 2020
Link: https://doi.org/10.1007/..
 
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12

Solder Joint Characterization:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 299-354 , 2020
Link: https://doi.org/10.1007/..
 
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13

Advanced Specialty Flux Design:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 217-298 , 2020
Link: https://doi.org/10.1007/..
 
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14

Prevailing Lead-Free Materials:

, In: Assembly and Reliability of Lead-Free Solder Joints,
Lau, John H. ; Lee, Ning-Cheng - p. 63-136 , 2020
Link: https://doi.org/10.1007/..
 
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15

Pressureless Sintering Process of Ag Sinter Paste Bonding A..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Fan, Guangyu ; Labarbera, Christine ; Lee, Ning-Cheng.. - p. 1338-1343 , 2020
Link: https://doi.org/10.1109/..
 
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