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Lee, Shi-Wei Ricky
21  Ergebnisse:
Personensuche X
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1

3D Co-packaging of GaN/SiC Cascode Device for High-Frequenc..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Shu, Ji ; Sun, Jiahui ; Tao, Mian... - p. 486-489 , 2024
Link: https://doi.org/10.1109/..
 
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2

Nano-scale and Atomistic-Scale Modeling of Advanced Materia..:

, In: Nano-Bio- Electronic, Photonic and MEMS Packaging,
Dai, Ruo Li ; Liao, Wei-Hsin ; Lin, Chun-Te.. - p. 555-577 , 2021
Link: https://doi.org/10.1007/..
 
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3

From LED to solid state lighting: principles, materials, pa..:

Lee, Shi-Wei Ricky ; Lo, Jeffery C. C ; Tao, Mian. , 2021
Link: https://onlinelibrary.wi..
 
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4

Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Cur..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Xu, Qianwen ; Lee, Shi-Wei Ricky ; Chi Chuen Lo, Jeffery - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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5

Investigation of Processing Parameters for the Fabrication ..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Xu, Qianwen ; Lo, Jeffery Chi Chuen ; Lee, Shi-Wei Ricky - p. 640-644 , 2019
Link: https://doi.org/10.1109/..
 
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6

3D chip stacking with through silicon-vias (TSVs) for verti..:

Le, Fuliang ; Lee, Shi-Wei Ricky ; Zhang, Qiming
Journal of Micromechanics and Microengineering.  27 (2017)  4 - p. 045012 , 2017
Link: https://doi.org/10.1088/..
 
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7

Numerical Prediction and Experimental Validation of Multipl..:

Lo, Jeffery Chi-Chuen ; Lee, Shi-Wei Ricky ; Guo, Xungao.
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-005-1-E16-005-7 , 2016
Link: https://doi.org/10.5104/..
 
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8

Electrical–thermal–luminous–chromatic model of phosphor-con..:

Ye, Huaiyu ; Koh, Sau Wee ; Yuan, Cadmus...
Applied Thermal Engineering.  63 (2014)  2 - p. 588-597 , 2014
Link: https://doi.org/10.1016/..
 
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9

Computational Analysis for the Torsional Vibration Control ..:

Lee, Shi-Wei Ricky ; Li, Hing Leung
Journal of Intelligent Material Systems and Structures.  10 (1999)  7 - p. 530-533 , 1999
Link: https://doi.org/10.1106/..
 
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10

Directly Printed Hollow Connectors for Microfluidic Interco..:

Qianwen Xu ; Jeffery Chi Chuen Lo ; Shi-Wei Ricky Lee
https://www.mdpi.com/2076-3417/10/10/3384.  , 2020
Link: https://doi.org/10.3390/..
 
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11

Imaging of Tumor-Associated Vascular Prostate-Specific Memb..:

Sergeeva, Olga ; Zhang, Yifan ; Julian, Willian...
Gastro Hep Advances.  1 (2022)  4 - p. 631-639 , 2022
Link: https://doi.org/10.1016/..
 
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12

Chip scale package (CSP) 

design, materials, processes, reliability, and applications  Electronic packaging and interconnection series
Lau, John H. , 1999
Exemplar:  Zentrale: a elt 695 f/690
 
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13

Artificial Intelligence and Internet of Things for Robotic ..:

, In: 2020 International Conference on Advanced Robotics and Intelligent Systems (ARIS),
Lee, Min-Fan Ricky ; Chien, Tzu-Wei - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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14

Intelligent Robot for Worker Safety Surveillance: Deep Lear..:

, In: 2020 International Conference on Advanced Robotics and Intelligent Systems (ARIS),
Lee, Min-Fan Ricky ; Chien, Tzu-Wei - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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15

Empirical Modeling and measurement of the Pulsed Junction T..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Shieh, Brian ; Zeng, Fangyun ; Yang, Guoming... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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