E-LIB Suche - Ergebnisse für: Lee, Tae-Ik

1

Evaluating Free Thermal Expansion and Glass Transition of U..:

Lee, Tae-Ik ; Kim, Ji Hun ; Kim, Dong Jun.
ACS Applied Materials & Interfaces. 16 (2024) 23 - p. 30336-30343 , 2024

Link: https://doi.org/10.1021/..

2

Fast, facile and thermal damage free nanowelding of Ag nano..:

Jeong, Jong-Min ; Sohn, Minjeong ; Bang, Junghwan..
Scientific Reports. 13 (2023) 1 - p. , 2023

Link: https://doi.org/10.1038/..

3

Siloxane Hybrid Material-Encapsulated Highly Robust Flexibl..:

Lee, Han Eol ; Lee, Daewon ; Lee, Tae-Ik...
ACS Applied Materials & Interfaces. 14 (2022) 24 - p. 28258-28269 , 2022

Link: https://doi.org/10.1021/..

4

Power cycling tests under driving ΔTj = 125 °C on the Cu cl..:

Kim, Dongjin ; Lee, Byeongsoo ; Lee, Tae-Ik...
Microelectronics Reliability. 138 (2022) - p. 114652 , 2022

Link: https://doi.org/10.1016/..

5

Enlarged tensile strain at edge of flexible substrate due t..:

Jo, Woosung ; Lee, Tae-Ik ; Kim, Taek-Soo
Microelectronics Reliability. 130 (2022) - p. 114485 , 2022

Link: https://doi.org/10.1016/..

6

Joint reliability of Al wire bonding on OSP and ENIG surfac..:

Ahn, Byeongjin ; Kim, Jahyeon ; Cheon, Gyeong-Yeong...
Journal of Materials Science: Materials in Electronics. 33 (2022) 26 - p. 21127-21136 , 2022

Link: https://doi.org/10.1007/..

7

Interfacial Reactions and Mechanical Properties of Sn–58Bi ..:

Jeong, Gyuwon ; Yu, Dong-Yurl ; Baek, Seongju...
Materials. 14 (2021) 2 - p. 335 , 2021

Link: https://doi.org/10.3390/..

8

Creation of Curved Nanostructures Using Soft-Materials-Deri..:

Jang, Hyun-Ik ; Yoon, Hae-Su ; Lee, Tae-Ik...
Nanomaterials. 10 (2020) 12 - p. 2414 , 2020

Link: https://doi.org/10.3390/..

9

Improved sinterability of micro-scale copper paste with a r..:

Kwon, Soonyong ; Lee, Tae-Ik ; Lee, Hoo-Jeong.
Materials Letters. 269 (2020) - p. 127656 , 2020

Link: https://doi.org/10.1016/..

10

Direct Visualization of Cross-Sectional Strain Distribution..:

Lee, Tae-Ik ; Jo, Woosung ; Kim, Wansun...
ACS Applied Materials & Interfaces. 11 (2019) 14 - p. 13416-13422 , 2019

Link: https://doi.org/10.1021/..

11

Wireless powered wearable micro light-emitting diodes:

Lee, Han Eol ; Lee, Daewon ; Lee, Tae-Ik...
Nano Energy. 55 (2019) - p. 454-462 , 2019

Link: https://doi.org/10.1016/..

12

Thermal expansion behavior of thin films expanding freely o..:

Kim, Jae-Han ; Jang, Kyung-Lim ; Ahn, Kwangho...
Scientific Reports. 9 (2019) 1 - p. , 2019

Link: https://doi.org/10.1038/..

13

Wearable, Ultrawide-Range, and Bending-Insensitive Pressure..:

Kim, Seunghwan ; Amjadi, Morteza ; Lee, Tae-Ik...
ACS Applied Materials & Interfaces. 11 (2019) 26 - p. 23639-23648 , 2019

Link: https://doi.org/10.1021/..

14

Performance improvement of flexible piezoelectric energy ha..:

Khan, Muhammad Bilawal ; Kim, Dong Hyun ; Han, Jae Hyun...
Nano Energy. 58 (2019) - p. 211-219 , 2019

Link: https://doi.org/10.1016/..

15

An extended analytic model for the elastic properties of pl..:

Kim, Youngsoo ; Kim, Yongtae ; Lee, Tae-Ik..
Composite Structures. 189 (2018) - p. 27-36 , 2018

Link: https://doi.org/10.1016/..