Lee, Taeyoung
2131  Ergebnisse:
Personensuche X
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1

Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Las..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Han, Sang Eun ; Han, Seonghui ; Lee, Tae-Young.. - p. 85-86 , 2024
 
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6

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap ..:

Kim, Seoah ; Kim, YehRi ; Jo, Eunjin...
Journal of Materials Research and Technology.  30 (2024)  - p. 6668-6685 , 2024
 
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8

Boosting with variant-matched adenovirus-based vaccines pro..:

Shin, Kwang-Soo ; Kim, Byung-Seok ; Chang, Soojeong...
International Journal of Antimicrobial Agents.  63 (2024)  3 - p. 107082 , 2024
 
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10

Equivariant Reinforcement Learning for Quadrotor UAV:

, In: 2023 American Control Conference (ACC),
Yu, Beomyeol ; Lee, Taeyoung - p. 2842-2847 , 2023
 
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15

Interfacial microstructure and brittle fracture behavior of..:

Lee, Tae-Young ; Kim, Jungsoo ; Jun, So-Yeon...
Journal of Materials Science: Materials in Electronics.  34 (2023)  2 - p. , 2023
 
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