E-LIB Suche - Ergebnisse für: Lee, Teck Kheng

1

A Novel Low-Cost Capacitance Sensor Solution for Real-Time ..:

Kok, Chiang Liang ; Dai, Yuwei ; Lee, Teck Kheng...
Electronics. 13 (2024) 6 - p. 1111 , 2024

Link: https://doi.org/10.3390/..

2

Design and Testing of an Intramedullary Nail Implant Enhanc..:

Kok, Chiang Liang ; Tan, Tat Chin ; Koh, Yit Yan..
Electronics. 13 (2024) 8 - p. 1519 , 2024

Link: https://doi.org/10.3390/..

3

A Novel and Self-Calibrating Weighing Sensor with Intellige..:

Kok, Chiang Liang ; Ho, Chee Kit ; Dai, Yuwei...
Electronics. 13 (2024) 9 - p. 1724 , 2024

Link: https://doi.org/10.3390/..

4

A Novel and Low-Cost Cloud-Enabled IoT Integration for Sust..:

Kok, Chiang Liang ; Ho, Chee Kit ; Lee, Teck Kheng...
Electronics. 13 (2024) 10 - p. 1801 , 2024

Link: https://doi.org/10.3390/..

5

A pilot clinical study of developing an External Assist Tar..:

Wu, Qinghui ; Esuvaranathan, Kesavan ; Lee, Teck Kheng...
Asian Journal of Urology. 10 (2023) 3 - p. 364-371 , 2023

Link: https://doi.org/10.1016/..

6

Effects of Sterilization Cycles on PEEK for Medical Device ..:

Kumar, Amit ; Yap, Wai Teng ; Foo, Soo Leong.
Bioengineering. 5 (2018) 1 - p. 18 , 2018

Link: https://doi.org/10.3390/..

7

Corrosion of Gold and Copper Ball Bonds:

Breach, Christopher D. ; Ng, Hun Shen ; Lee, Teck Kheng.
ECS Transactions. 34 (2011) 1 - p. 831-841 , 2011

Link: https://doi.org/10.1149/..

8

Dissolution and reaction between Au and molten eutectic PbS..:

Lee, Teck Kheng ; Zhang, Sam ; Wong, C.C..
Materials Science and Engineering: A. 427 (2006) 1-2 - p. 136-141 , 2006

Link: https://doi.org/10.1016/..

9

Interfacial microstructures and kinetics of Au/SnAgCu:

Lee, Teck Kheng ; Zhang, Sam ; Wong, C.C...
Thin Solid Films. 504 (2006) 1-2 - p. 441-445 , 2006

Link: https://doi.org/10.1016/..

10

Instantaneous fluxless bonding of Au with Pb–Sn solder in a..:

Lee, Teck Kheng ; Zhang, Sam ; Wong, Chee Cheong.
Journal of Applied Physics. 98 (2005) 3 - p. , 2005

Link: https://doi.org/10.1063/..

11

Material and design considerations of FBGA reliability perf..:

Lee, Teck Kheng ; Ng, Teng Chye ; Chai, Yih Ming
Thin Solid Films. 462-463 (2004) - p. 465-470 , 2004

Link: https://doi.org/10.1016/..

12

Empirical equations for moisture absorption of a rigid subs..:

Lee, Teck Kheng ; Lee, Kian Chai ; Khoo, Sian Yong
Thin Solid Films. 462-463 (2004) - p. 427-435 , 2004

Link: https://doi.org/10.1016/..

13

Fluxless flip chip bonding with joint-in-via architecture:

Kheng Lee, Teck ; Zhang, Sam ; Wong, C.C..
Thin Solid Films. 504 (2006) 1-2 - p. 436-440 , 2006

Link: https://doi.org/10.1016/..

14

A pilot clinical study of developing an External Assist Tar..:

Wu, Qinghui ; Esuvaranathan, Kesavan ; Lee, Teck Kheng...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10394285/. , 2023

Link: http://www.ncbi.nlm.nih...

15

Effects of Sterilization Cycles on PEEK for Medical Device ..:

Kumar, Amit ; Yap, Wai Teng ; Foo, Soo Leong.
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC5874884/. , 2018

Link: http://www.ncbi.nlm.nih...