Lee, Yung-chun
12223  Ergebnisse:
Personensuche X
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3

A digital 3D TCAM accelerator for the inference phase of Ra..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
 
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6

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
 
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7

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
 
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8

Passive wireless strain and crack sensing using a RFID-base..:

Zhang, Binpeng ; Lyu, Yan ; Lee, Yung-chun
Journal of Physics: Conference Series.  2198 (2022)  1 - p. 012018 , 2022
 
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10

Soft photomask lithography and droplet spreading nano-impri..:

Tu, Pei-Chi ; Lee, Yung-Chun
Microelectronic Engineering.  241 (2021)  - p. 111528 , 2021
 
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11

Application of Closed Magnetic Circuit Method for Evaluatin..:

Di, Jingyu ; He, Cunfu ; Liu, Xiucheng.
IOP Conference Series: Materials Science and Engineering.  1102 (2021)  1 - p. 012012 , 2021
 
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12

Evaluation of the stress gradient of the superficial layer ..:

Di, Jingyu ; He, Cunfu ; Lee, Yung-Chun.
Nondestructive Testing and Evaluation.  37 (2021)  1 - p. 41-55 , 2021
 
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14

Droplet spreading nanoimprinting method for micro-/nano-fab..:

Tu, Pei-Chi ; Lee, Yung-Chun
Journal of Micromechanics and Microengineering.  30 (2020)  8 - p. 085003 , 2020
 
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