Leng, Poh Hock
61  Ergebnisse:
Personensuche X
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4

Cu Pillar Bump Oxidation Control in Flip Chip Package:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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7

The exploration and characterization of insulated Au-Flash ..:

, In: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC),
Teck, Siong Chin ; Leng, Eu Poh ; Chu, Tan Lan... - p. 574-579 , 2016
 
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8

A Study on Inter-Metallic Compound Formation and Structure ..:

, In: 2006 IEEE International Conference on Semiconductor Electronics,
Ahmad, I. ; Jiun, Hoh Huey ; Leng, Eu Poh... - p. None , 2006
 
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9

Solder Extrusion Characterization Study on SiP Modules Indu..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
 
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14

A Computationally Efficient Formulation for Traffic Signal ..:

, In: 2022 8th International Conference on Control, Decision and Information Technologies (CoDIT),
Jagadeesh, George R. ; Yang, Jielin ; Ng, Kien Ming... - p. 821-826 , 2022
 
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