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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) ,
4
Cu Pillar Bump Oxidation Control in Flip Chip Package:
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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) ,
7
The exploration and characterization of insulated Au-Flash ..:
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2006 IEEE International Conference on Semiconductor Electronics ,
8
A Study on Inter-Metallic Compound Formation and Structure ..:
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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) ,
9
Solder Extrusion Characterization Study on SiP Modules Indu..:
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2022 8th International Conference on Control, Decision and Information Technologies (CoDIT) ,
14