Leppävuori, Seppo
57  Ergebnisse:
Personensuche X
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1

Fabrication of silicon based through-wafer interconnects fo..:

Ji, Fan ; Leppävuori, Seppo ; Luusua, Ismo...
Sensors and Actuators A: Physical.  142 (2008)  1 - p. 405-412 , 2008
 
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2

Via-in-pixel design of truly 2D extendable photodiode detec..:

Ji, Fan ; Kalliopuska, Juha ; Eränen, Simo...
Sensors and Actuators A: Physical.  145-146 (2008)  - p. 59-65 , 2008
 
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5

Solder joint reliability in AgPt‐metallized LTCC modules:

Nousiaianen, Olli ; Rautioaho, Risto ; Kautio, Kari..
Soldering & Surface Mount Technology.  17 (2005)  3 - p. 32-42 , 2005
 
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7

Characterization and modelling of 3D piezoelectric ceramic ..:

Heinonen, Esa ; Juuti, Jari ; Leppävuori, Seppo
Journal of the European Ceramic Society.  25 (2005)  12 - p. 2467-2470 , 2005
 
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11

BST powder with sol-gel process in tape casting and firing:

Hu, Tao ; Jantunen, Heli ; Uusimäki, Antti.
Journal of the European Ceramic Society.  24 (2004)  6 - p. 1111-1116 , 2004
 
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12

LTCC compatible PLZT thick-films for piezoelectric devices:

Juuti, Jari ; Łoziński, Andrzej ; Leppävuori, Seppo
Sensors and Actuators A: Physical.  110 (2004)  1-3 - p. 361-364 , 2004
 
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14

Electric‐Field‐Controlled Permittivity Ferroelectric Compos..:

Hu, Tao ; Jantunen, Heli ; Deleniv, Anatoli..
Journal of the American Ceramic Society.  87 (2004)  4 - p. 578-583 , 2004
 
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15

Printing parameters and ink components affecting ultra-fine..:

Pudas, Marko ; Hagberg, Juha ; Leppävuori, Seppo
Journal of the European Ceramic Society.  24 (2004)  10-11 - p. 2943-2950 , 2004
 
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