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Leusink, Gert J.
163  Ergebnisse:
Personensuche X
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1

Unfolding an Elusive Area-Selective Deposition Process: Ato..:

Mameli, Alfredo ; Tapily, Kanda ; Shen, Jie...
ACS Applied Materials & Interfaces.  16 (2024)  11 - p. 14288-14295 , 2024
Link: https://doi.org/10.1021/..
 
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2

Local Epitaxial Templating Effects in Ferroelectric and Ant..:

Chae, Kisung ; Lombardo, Sarah F. ; Tasneem, Nujhat...
ACS Applied Materials & Interfaces.  14 (2022)  32 - p. 36771-36780 , 2022
Link: https://doi.org/10.1021/..
 
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3

Efficiency of Ferroelectric Field-Effect Transistors: An Ex..:

Tasneem, Nujhat ; Islam, Muhammad M. ; Wang, Zheng...
IEEE Transactions on Electron Devices.  69 (2022)  3 - p. 1568-1574 , 2022
Link: https://doi.org/10.1109/..
 
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4

Process-Induced ReRAM Performance Improvement of Atomic Lay..:

Consiglio, Steven ; Higuchi, Hisashi ; Ando, Takashi...
ECS Transactions.  102 (2021)  2 - p. 19-28 , 2021
Link: https://doi.org/10.1149/..
 
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5

Ferroelectric Phase Content in 7 nm Hf(1−x)ZrxO2 Thin Films..:

Mukundan, Vineetha ; Consiglio, Steven ; Triyoso, Dina H....
physica status solidi (a).  218 (2021)  10 - p. , 2021
Link: https://doi.org/10.1002/..
 
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6

Trap Capture and Emission Dynamics in Ferroelectric Field-E..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Tasneem, Nujhat ; Wang, Zheng ; Zhao, Zijian... - p. 6.1.1-6.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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7

RRAM Devices with Plasma Treated HfO2 with Ru as Top Electr..:

Patel, Yuvraj ; Misra, Durga ; Triyoso, Dina H....
ECS Transactions.  104 (2021)  3 - p. 35-44 , 2021
Link: https://doi.org/10.1149/..
 
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8

Quantifying non-centrosymmetric orthorhombic phase fraction..:

Mukundan, Vineetha ; Consiglio, Steven ; Triyoso, Dina H....
Applied Physics Letters.  117 (2020)  26 - p. , 2020
Link: https://doi.org/10.1063/..
 
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9

Process Dependent Optimization of Dielectric and Metal Stac..:

Zhao, Pengxiang ; Misra, Durga ; Triyoso, Dina...
ECS Transactions.  97 (2020)  3 - p. 13-20 , 2020
Link: https://doi.org/10.1149/..
 
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10

Plasma-induced roughness and chemical modifications of TiN ..:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
Rogalskyj, Sophia ; Frost, Hunter ; Palka, Amber... - p. 49-51 , 2020
Link: https://doi.org/10.1109/..
 
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11

Material Innovation in the Era of Artificial Intelligence -..:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Triyoso, Dina H. ; Clark, Robert D. ; Consiglio, Steven... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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12

Wafer Surface Control for Ru Capping on Cu interconnect:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
Aizawa, Hirokazu ; Yu, Kai-Hung ; Pattanaik, Gyana.. - p. 10-12 , 2020
Link: https://doi.org/10.1109/..
 
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13

Multilevel Resistive Switching in Hf-Based RRAM:

Jain, Barsha ; Huang, Chia-sheng ; Misra, Durgamadhab...
ECS Transactions.  89 (2019)  3 - p. 39-44 , 2019
Link: https://doi.org/10.1149/..
 
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14

Structural Correlation of Ferroelectric Behavior in Mixed H..:

Mukundan, Vineetha ; Beckmann, Karsten ; Tapily, Kandabara...
MRS Advances.  4 (2019)  9 - p. 545-551 , 2019
Link: https://doi.org/10.1557/..
 
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15

Rethinking surface reactions in nanoscale dry processes tow..:

Ishikawa, Kenji ; Ishijima, Tatsuo ; Shirafuji, Tatsuru...
Japanese Journal of Applied Physics.  58 (2019)  SE - p. SE0801 , 2019
Link: https://doi.org/10.7567/..
 
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