Ley, Ryan
299  Ergebnisse:
Personensuche X
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1

Challenges and Innovations in Dual Damascene Polymer RDL wi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Briggs, Benjamin D. ; Ley, Ryan ; Bencher, Chris... - p. 571-575 , 2024
 
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2

300 nm Pitch W2W HBI for CFET and 3D DRAM Through Module Co..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sherwood, Tyler ; Patlolla, Raghuveer ; McIntyre, Dylan... - p. 1968-1972 , 2024
 
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3

Polymer Based Dual Damascene Process for Fine Pitch RDL Adv..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Hsiang-Yao, Hsiao ; Ley, Ryan ; Suo, Peng.. - p. 391-395 , 2023
 
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4

Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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6

58‐1: Invited Paper: Overcoming the Challenges in microLED ..:

Lewis, David ; Dechter, Rimma ; Ley, Ryan..
SID Symposium Digest of Technical Papers.  52 (2021)  1 - p. 814-817 , 2021
 
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7

25.1:Invited Paper:Overcoming the Challenges in microLED In..:

Lewis, David ; Dechter, Rimma ; Ley, Ryan..
SID Symposium Digest of Technical Papers.  52 (2021)  S2 - p. 328-331 , 2021
 
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13

Psychotic Disorders:

, In: Problem-Based Behavioral Science and Psychiatry,
Zuchowski, Steven J. ; Ley, Ryan - p. 289-308 ,
 
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