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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
1
Optimize Stencil Apertures to Eliminate SMT Solder Defects ..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Minimize Bottom Termination Component Voids by Board Assemb..:
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2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Improve Solder Extrusion for Large Size Stand Alone Module:
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2022 IEEE International Symposium on Circuits and Systems (ISCAS) ,
12
A Single-Inductor Triple-Output Buck-Boost Converter with O..:
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2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
13