Li, Yun-Tsung
3732  Ergebnisse:
Personensuche X
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1

Optimize Stencil Apertures to Eliminate SMT Solder Defects ..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hong, Ling-Ying ; Li, Yun-Tsung - p. 312-316 , 2023
 
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2

Minimize Bottom Termination Component Voids by Board Assemb..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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3

Improve Solder Extrusion for Large Size Stand Alone Module:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Wei, Tzu-Yin ; Lin, Cheng-Tso ; Li, Hsin-De. - p. 166-168 , 2019
 
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4

Interleukin-23 Mediates Osteoclastogenesis in Collagen-Indu..:

Chen, Shih-Yao ; Tsai, Ting-Chien ; Li, Yuan-Tsung...
International Journal of Molecular Sciences.  23 (2022)  17 - p. 9718 , 2022
 
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6

EphA2 is a biomarker of hMSCs derived from human placenta a..:

Shen, Shih-Pei ; Liu, Wei-Ting ; Lin, Yun...
Taiwanese Journal of Obstetrics and Gynecology.  54 (2015)  6 - p. 749-756 , 2015
 
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7

Synthesis of WO3 Nanorods by Thermal CVD at Various Gas Flo..:

Hsieh, Yun-Tsung ; Chang, Li-Wei ; Chang, Chen-Chuan.
Electrochemical and Solid-State Letters.  14 (2011)  7 - p. K40 , 2011
 
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10

Kaguacidine A: a novel spirohydantoin-containing cucurbitan..:

Huang, Hung-Tse ; Lo, I-Wen ; Lin, Yu-Chi...
Natural Product Research.  38 (2023)  13 - p. 2179-2186 , 2023
 
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12

A Single-Inductor Triple-Output Buck-Boost Converter with O..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsu, Zhi-Yun ; Liu, Chi-Wei ; Wu, Jun-Wan... - p. 3575-3578 , 2022
 
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13

Si Metal-Oxide-Semiconductor and Si/SiGe Heterostructure Qu..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Wu, Yu-Jui ; Chiang, Chih-Ying ; Tsao, Hung-Yu... - p. 1-2 , 2022
 
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14

Hericium erinaceus mycelium ameliorate anxiety induced by c..:

Li, Tsung-Ju ; Lee, Tung-Yen ; Lo, Yun...
BMC Complementary Medicine and Therapies.  21 (2021)  1 - p. , 2021
 
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