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2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE) ,
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A Deep-Learning-Aided Optimal Operation Model for Integrate..:
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IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society ,
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Analysis and Suppression Method of Motor Current Fluctuatio..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
7
Study on Thermal Compensation Treatment Method of Strain Me..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
8
EOS-induced failure analysis of FPGAs:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Research on Pad Size Design of 1210/0805 Surface Mounting C..:
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2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) ,
10
Vibration suppression and control parameter design of a sen..:
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2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Decapsulation Method for 3D Stacked-die Packaged Devices:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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