E-LIB Suche - Ergebnisse für: Liang, Chien-Lung

1

Direct Observation of Void Nucleation and Growth in a 2-µm-..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Liang, Chien-Lung ; Lin, Yung-Sheng ; Tsai, Min-Yan... - p. 1-2 , 2024

Link: https://doi.org/10.23919..

2

Applications of Ni and Ag metallizations at the solder/Cu i..:

Chiu, Meng-Chun ; Tsai, Min-Yan ; Wang, Shan-Bo..
Surface and Coatings Technology. 484 (2024) - p. 130828 , 2024

Link: https://doi.org/10.1016/..

3

Development of a novel processing technique for cold-rolled..:

Chen, Yung-Hua ; Chiu, Meng-Chun ; Huang, Hsuan-Cheng.
Materials Letters. 369 (2024) - p. 136738 , 2024

Link: https://doi.org/10.1016/..

4

An Electromigration Study of Cu Pillar Interconnects in Fli..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Tsai, Min-Yan ; Kao, Chin-Li ; Wang, Shan-Bo... - p. 326-332 , 2023

Link: https://doi.org/10.1109/..

5

Phase Equilibria of the Ag-Al-Au Ternary System and Interfa..:

Ramadhani, Mavindra ; Laksono, Andromeda Dwi ; Liang, Chien-Lung...
Materials. 16 (2023) 22 - p. 7196 , 2023

Link: https://doi.org/10.3390/..

6

Non-epitaxial silver nanodendrite growth via helical nano-y..:

Tsai, Wen-Chieh ; Liang, Chien-Lung ; Lin, Kwang-Lung
Scripta Materialia. 212 (2022) - p. 114586 , 2022

Link: https://doi.org/10.1016/..

7

Novel Ga Assisted Low-temperature Bonding Technology for Fi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Wang, Shan-Bo ; Hsu, An-Hsuan ; Kao, Chin-Li... - p. 330-334 , 2022

Link: https://doi.org/10.1109/..

8

Inhibiting the detrimental Cu protrusion in Cu through-sili..:

Lin, Ting-Chun ; Liang, Chien-Lung ; Wang, Shan-Bo...
Scripta Materialia. 197 (2021) - p. 113782 , 2021

Link: https://doi.org/10.1016/..

9

Electromigration-assisted manipulation of microstructure an..:

Ku, Pu-Hsin ; Liang, Chien-Lung ; Lin, Kwang-Lung
Materials Characterization. 174 (2021) - p. 110980 , 2021

Link: https://doi.org/10.1016/..

10

A comprehensive study of electromigration in pure Sn: Effec..:

Liao, Yi-Han ; Chen, Chang-Hsien ; Liang, Chien-Lung..
Acta Materialia. 200 (2020) - p. 200-210 , 2020

Link: https://doi.org/10.1016/..

11

Investigations of high-temperature tensile properties of Zn..:

Lin, Jeng-Chi ; Liang, Chien-Lung ; Lin, Kwang-Lung
Journal of Materials Science: Materials in Electronics. 31 (2020) 21 - p. 19318-19331 , 2020

Link: https://doi.org/10.1007/..

12

Athermal and thermal coupling electromigration effects on t..:

Liang, Chien-Lung ; Lin, Yung-Sheng ; Kao, Chin-Li...
Materials Chemistry and Physics. 256 (2020) - p. 123680 , 2020

Link: https://doi.org/10.1016/..

13

Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Liang, Chien-Lung ; Lin, Yung-Sheng ; Kao, Chin-Li... - p. 361-366 , 2020

Link: https://doi.org/10.1109/..

14

Electro-work hardening of metals induced by the athermal el..:

Shu, Chih-Chi ; Liang, Chien-Lung ; Lin, Kwang-Lung
Materials Science and Engineering: A. 772 (2020) - p. 138689 , 2020

Link: https://doi.org/10.1016/..

15

Non-equilibrium supersaturation behavior in a Cu/Sn/Cu inte..:

Liang, Chien-Lung ; Lin, Kwang-Lung
Journal of Alloys and Compounds. 789 (2019) - p. 336-344 , 2019

Link: https://doi.org/10.1016/..