E-LIB Suche - Ergebnisse für: Liang, Shuibao

1

Effect of Phase Evolution on Inhomogeneous Deformation and ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Liang, Shuibao ; Li, Wangyun ; Jiang, Han.. - p. 161-162 , 2024

2

Investigating the preferential growth of Bi grains in Sn-Bi..:

Liang, Shuibao ; Jiang, Han ; Zhong, Zhihong..
Journal of Materials Research and Technology. 28 (2024) - p. 4152-4161 , 2024

Link: https://doi.org/10.1016/..

3

Investigation of Effects of Porosity and Coarsening on Ther..:

Jiang, Han ; Liang, Shuibao ; Xu, Yaohua.
IEEE Transactions on Electron Devices. , 2024

Link: https://doi.org/10.1109/..

4

Simulation Study of Pore Structure Evolution and its Influe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Jiang, Han ; Liang, Shuibao ; Liu, Changqing - p. 159-160 , 2024

Link: https://doi.org/10.23919..

5

Insights Into the Grain Orientation Effect on Electromigrat..:

Liang, Shuibao ; Jiang, Han ; Zhong, Zhihong.
IEEE Transactions on Electron Devices. 71 (2024) 1 - p. 192-199 , 2024

Link: https://doi.org/10.1109/..

6

Heat transfer in phase change materials for integrated batt..:

Zhang, Li ; Zhao, Huayong ; Liang, Shuibao.
Applied Thermal Engineering. 232 (2023) - p. 120997 , 2023

Link: https://doi.org/10.1016/..

7

Study on PhaseElectromigration and Segregation Behavior of ..:

Liang, Shuibao ; Jiang, Han ; Huang, Jiaqiang
Journal of Electronic Materials. 53 (2023) 3 - p. 1192-1200 , 2023

Link: https://doi.org/10.1007/..

8

Phase field modelling combined with data-driven approach to..:

Liang, Shuibao ; Wei, Cheng ; Kunwar, Anil...
Surfaces and Interfaces. 37 (2023) - p. 102728 , 2023

Link: https://doi.org/10.1016/..

9

Investigation of Electrical–Thermal–Mechanical Effects in E..:

Liang, Shuibao ; Liu, Changqing ; Jiang, Han.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 11 - p. 1764-1769 , 2023

Link: https://doi.org/10.1109/..

10

Microstructural and mechanical integrity of Cu/Cu joints fo..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Jiang, Han ; Robertson, Stuart ; Liang, Shuibao... - p. 964-968 , 2022

Link: https://doi.org/10.1109/..

11

Unraveling the electric field effect on the grain‐boundary ..:

Liang, Shuibao ; Zhang, Xin‐Ping
Journal of the American Ceramic Society. 106 (2022) 3 - p. 1647-1652 , 2022

Link: https://doi.org/10.1111/..

12

Phase field study of grain boundary migration and preferent..:

Liang, Shuibao ; Liu, Changqing ; Zhou, Zhaoxia
Materials Today Communications. 31 (2022) - p. 103408 , 2022

Link: https://doi.org/10.1016/..

13

Bonding with Zn-based solders through self-propagating exot..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Liu, Canyu ; Jiang, Han ; Liang, Shuibao... - p. 439-442 , 2022

Link: https://doi.org/10.1109/..

14

Investigation of thermal effect on solidification in Sn/Cu ..:

Liang, Shuibao ; Zhong, Yi ; Robertson, Stuart...
Microelectronics Reliability. 138 (2022) - p. 114654 , 2022

Link: https://doi.org/10.1016/..

15

Self-propagating exothermic reaction assisted Cu clip bondi..:

Liu, Canyu ; Liu, Allan ; Jiang, Han...
Microelectronics Reliability. 138 (2022) - p. 114688 , 2022

Link: https://doi.org/10.1016/..