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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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Reliability study of Au-Al wire bond under Cl environment:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
2
Chlorine effect on copper bonding wire reliability:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
3
Studies of Passivation (Si3N4/SiO2) Qualification Method in..:
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2023 China Semiconductor Technology International Conference (CSTIC) ,
4
Faster AU-AL IMC Growth Under Chlorine Environment:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
5
Study of moisture penetration in chip passivation layer by ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
7
Chlorine and sulfur effects on copper-aluminum wire bond re..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
8
Studies of Electron Backscattered Diffraction (EBSD) Analys..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
9
Study of moisture penetration in polymer encapsulant by deu..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
10
Comprehensive Comparison of the Wire Bond Reliability Perfo..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
11
bHAST, PCT, TCT reliability performance comparison of Cu-Al..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
12
Enhancing High Temperature Adhesion Performance Via a Renov..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
13
A study on an abnormal oxidation issue of copper bonding wi..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
14
Comprehensive study of wire bond reliability impacts from w..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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