Lim, Jae-Wook
11429  Ergebnisse:
Personensuche X
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1

Development of Power Hardware-in-the-Loop Simulation Test-b..:

Lim, Jae-Wook ; Heo, Kyung-Wook ; Jeon, Chan-o..
Journal of Electrical Engineering & Technology.  19 (2024)  5 - p. 3297-3308 , 2024
 
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2

Effective Test Method of QAB Converter-Based LVDC Distribut..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Lim, Jae-Wook ; Heo, Kyung-Wook ; Jung, Jee-Hoon - p. 1712-1717 , 2023
 
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6

47‐1: Invited Paper: A 6Gbps Intra‐Panel Interface with Vid..:

Jang, Won-Ho ; Ryu, Kyungho ; Lim, Jung-Pil...
SID Symposium Digest of Technical Papers.  55 (2024)  1 - p. 623-626 , 2024
 
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7

39‐2: Distinguished Paper: A Mobile OLED Display Driver IC ..:

Jo, Yun-Rae ; Yu, Chanbong ; Kim, Jungmoon...
SID Symposium Digest of Technical Papers.  55 (2024)  1 - p. 505-508 , 2024
 
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10

Input-shaping-based improvement in the machining precision ..:

Lim, Dong-Wook ; Hong, Seong-Wook ; Ha, Seok-Jae..
The International Journal of Advanced Manufacturing Technology.  125 (2023)  9-10 - p. 4415-4424 , 2023
 
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11

A 1.05-A/m Minimum Magnetic Field Strength Single-Chip, Ful..:

Chang, Ji-Soo ; Jang, Eunsang ; Choi, Youngkil...
IEEE Journal of Solid-State Circuits.  58 (2023)  1 - p. 155-166 , 2023
 
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12

31‐2: An Asynchronous Single‐Ended Touch Sensing Method for..:

Lee, Jin-Chul ; Park, Junchul ; Cho, Sung-yong...
SID Symposium Digest of Technical Papers.  54 (2023)  1 - p. 441-444 , 2023
 
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13

23‐3: Distinguished Paper: A Clock Embedded Intra‐panel Int..:

Park, Yong-Yun ; Jang, Won-Ho ; Kim, Kyoung-Ho...
SID Symposium Digest of Technical Papers.  54 (2023)  1 - p. 310-313 , 2023
 
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14

26.1 A Source-Driver IC Including Power-Switching Fast-Slew..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Ryu, Kyungho ; Jeong, Ji-Yong ; Lim, Jung-Pil... - p. 382-384 , 2023
 
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15

15‐3: Crosstalk Compensation Method Using ELVDD Coupling Mo..:

Yu, Tae-kon ; Ok, Jiheon ; Na, Sewhan...
SID Symposium Digest of Technical Papers.  54 (2023)  1 - p. 190-193 , 2023
 
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