Lim, Kyeongbin
10  Ergebnisse:
Personensuche X
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1

Achieving Sub-nm Copper Recess Controllability for Advanced..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Lim, Kyeongbin.. - p. 1322-1328 , 2024
 
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2

Finite Element Modeling for Wafer-to-Wafer Direct Bonding B..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Baek, Kyungmin ; Han, Min-soo ; Han, Il Young... - p. 1256-1259 , 2024
 
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3

Chip level evaluation of wafer-to-wafer direct bonding stre..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Baek, Kyungmin ; Kim, Juno ; Han, Min-soo.. - p. 310-317 , 2023
 
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4

Contamination-Free Cu/SiCN Hybrid Bonding Process Developme..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Shin, Donggap... - p. 1390-1396 , 2023
 
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5

Copper contamination control in Hybrid Copper Bonding:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kim, Wooyoung ; Han, Seung Ho ; Lee, Yongin... - p. 41-42 , 2023
 
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6

A Performance Testing Method of Bernoullie Picker for Ultra..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Juno ; Min, Dae Ho ; Lee, Kangsan... - p. 157-161 , 2022
 
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7

Plasma Chamber Environment Control to Enhance Bonding Stren..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Wooyoung ; Lee, Yongin ; Choi, Wonyoung... - p. 2008-2012 , 2022
 
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8

Design and Simulation of Symmetric Wafer-to-Wafer Bonding C..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lim, Kyeongbin ; Han, Minsoo ; Jo, Gwanghee... - p. 1480-1485 , 2020
 
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