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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Achieving Sub-nm Copper Recess Controllability for Advanced..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Finite Element Modeling for Wafer-to-Wafer Direct Bonding B..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Chip level evaluation of wafer-to-wafer direct bonding stre..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
Contamination-Free Cu/SiCN Hybrid Bonding Process Developme..:
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2023 International Conference on Electronics Packaging (ICEP) ,
5
Copper contamination control in Hybrid Copper Bonding:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A Performance Testing Method of Bernoullie Picker for Ultra..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Plasma Chamber Environment Control to Enhance Bonding Stren..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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