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Lim, Sung Kyu
13400  Ergebnisse:
Personensuche X
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1

Pin-3D: Effective Physical Design Methodology for Multidie ..:

Pentapati, Sai ; Chang, Kyungwook ; Lim, Sung Kyu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1009-1022 , 2024
Link: https://doi.org/10.1109/..
 
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2

Hier-3D: A Methodology for Physical Hierarchy Exploration o..:

Bethur, Nesara Eranna ; Agnesina, Anthony ; Brunion, Moritz...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  7 - p. 1957-1970 , 2024
Link: https://doi.org/10.1109/..
 
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3

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

Huang, Yen-Hsiang ; Pentapati, Sai ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  , 2024
Link: https://doi.org/10.1109/..
 
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4

A PPA Study for Heterogeneous 3-D IC Options: Monolithic, H..:

Kim, Jinwoo ; Zhu, Lingjun ; Torun, Hakki Mert..
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  32 (2024)  3 - p. 401-412 , 2024
Link: https://doi.org/10.1109/..
 
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5

GAN-Place: Advancing Open Source Placers to Commercial-qual..:

Lu, Yi-Chen ; Ren, Haoxing ; Hsiao, Hao-Hsiang.
ACM Transactions on Design Automation of Electronic Systems.  29 (2024)  2 - p. 1-17 , 2024
Link: https://doi.org/10.1145/..
 
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6

FastTuner: Transferable Physical Design Parameter Optimizat..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Hsiao, Hao-Hsiang ; Lu, Yi-Chen ; Vanna-Iampikul, Pruek. - p. 93-101 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

Power, Performance, Area, and Cost Analysis of Face-to-Face..:

Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  3 - p. 300-314 , 2023
Link: https://doi.org/10.1109/..
 
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8

RL-CCD: Concurrent Clock and Data Optimization using Attent..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
Lu, Yi-Chen ; Chan, Wei-Ting ; Guo, Deyuan... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

3DNN-Xplorer: A Machine Learning Framework for Design Space..:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Murali, Gauthaman ; Iyer, Aditya ; Ravichandran, Navneeth. - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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10

A 3D Implementation of Convolutional Neural Network for Fas..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
Miniskar, Narasinga Rao ; Vanna-Iampikul, Pruek ; Young, Aaron... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

GNN-based Multi-bit Flip-flop Clustering and Post-clusterin..:

Vanna-Iampikul, Pruek ; Lu, Yi-Chen ; Shim, Da Eun.
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  5 - p. 1-26 , 2023
Link: https://doi.org/10.1145/..
 
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12

On Continuing DNN Accelerator Architecture Scaling Using Ti..:

Murali, Gauthaman ; Iyer, Aditya ; Zhu, Lingjun...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  31 (2023)  10 - p. 1603-1613 , 2023
Link: https://doi.org/10.1109/..
 
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13

Abisko: Deep codesign of an architecture for spiking neural..:

Vetter, Jeffrey S. ; Date, Prasanna ; Fahim, Farah...
The International Journal of High Performance Computing Applications.  37 (2023)  3-4 - p. 351-379 , 2023
Link: https://doi.org/10.1177/..
 
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14

A PPA Study of Reinforced Placement Parameter Autotuning: P..:

Murali, Gauthaman ; Agnesina, Anthony ; Lim, Sung Kyu
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  5 - p. 1-22 , 2023
Link: https://doi.org/10.1145/..
 
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15

ECO-GNN: Signoff Power Prediction Using Graph Neural Networ..:

Lu, Yi-Chen ; Nath, Siddhartha ; Pentapati, Sai.
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  4 - p. 1-22 , 2023
Link: https://doi.org/10.1145/..
 
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