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Lim, Yeow Kheng
424  Ergebnisse:
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1

Multi-Axial Elastic Averaging for Sub-Micron Passive Alignm..:

Goh, Simon Chun Kiat ; Siah, Chun Fei ; Xu, Baochang...
Journal of Lightwave Technology.  41 (2023)  12 - p. 3986-3992 , 2023
Link: https://doi.org/10.1109/..
 
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2

Design, assembly and reliability of large die and fine-pitc..:

Ong, Yue Ying ; Ho, Soon Wee ; Vaidyanathan, Kripesh...
Microelectronics Reliability.  50 (2010)  7 - p. 986-994 , 2010
Link: https://doi.org/10.1016/..
 
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3

Underfill selection methodology for fine pitch Cu/low-k FCB..:

Ong, Xuefen ; Ho, Soon Wee ; Ong, Yue Ying...
Microelectronics Reliability.  49 (2009)  2 - p. 150-162 , 2009
Link: https://doi.org/10.1016/..
 
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4

A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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5

Structural Design and Optimization of 65nm Cu/low-k Flipchi..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Jimmy ; Tay, Andrew ; Zhang, Xiaowu... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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6

Effect of via etching process and postclean treatment on vi..:

Ho, Chiew Nyuk ; Lim, Yeow Kheng ; Gerald, Higelin...
Journal of Electronic Materials.  30 (2001)  12 - p. 1595-1601 , 2001
Link: https://doi.org/10.1007/..
 
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7

A Wafer Scale Hybrid Integration Platform for Co-packaged P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Venkatesan, Suresh ; Lee, James ; Kiat Goh, Simon Chun... - p. 381-382 , 2022
Link: https://doi.org/10.1109/..
 
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8

Passively Aligned Flip-chip Laser Diodes using Multi-axial ..:

Baochang Xu ; Yu Zhang ; Chun Fei Siah..
Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim (2022-09-18). Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™. 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 : 1-4. ScholarBank@NUS Repository..  , 2022
Link: https://scholarbank.nus...
 
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9

A Wafer Scale Hybrid Integration Platform for Co-packaged P..:

BAOCHANG XU ; YU ZHANG ; VOON YEW THEAN.
BAOCHANG XU, YU ZHANG, VOON YEW THEAN, YEOW KHENG LIM (2022-04-01). A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer. ScholarBank@NUS Repository..  , 2022
Link: https://scholarbank.nus...
 
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10

Contributors:

, In: Interfaces in Particle and Fibre Reinforced Composites,
Ansari, M.N.M. ; Asrofi, Mochamad ; Aswathi, M.K.... - p. xiii-xvii , 2020
Link: https://doi.org/10.1016/..
 
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11

Tuberculosis associated with Mycobacterium tuberculosisBeij..:

Sun, Yong-Jiang ; Lim, TK ; Ong, Adrian Kheng Yeow...
BMC Infectious Diseases.  6 (2006)  1 - p. , 2006
Link: https://doi.org/10.1186/..
 
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12

Ultra strong flexible Ba0.7Sr0.3Zr0.02Ti0.98O3/MWCNT/PVDF N..:

Mukherjee, Anindita ; Dasgupta Ghosh, Barnali ; Roy, Sunanda.
Chemical Engineering Journal.  488 (2024)  - p. 151014 , 2024
Link: https://doi.org/10.1016/..
 
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13

Customized Extrusion Nozzle Assisted Robust Nylon 6/MWCNT N..:

Roy, Sunanda ; Dasgupta Ghosh, Barnali ; Mishra, Sumit..
Chemical Engineering Journal.  493 (2024)  - p. 152598 , 2024
Link: https://doi.org/10.1016/..
 
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14

In situ observation on two 'elusive' rhodaliid siphonophore..:

Angulo-Preckler, Carlos ; Steckbauer, Alexandra ; Lim, Kah Kheng...
Frontiers in Marine Science.  11 (2024)  - p. , 2024
Link: https://doi.org/10.3389/..
 
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15

A tide of change: What we can learn from stories of marine ..:

Rossbach, Susann ; Steckbauer, Alexandra ; Klein, Shannon G....
One Earth.  6 (2023)  5 - p. 505-518 , 2023
Link: https://doi.org/10.1016/..
 
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