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Lim, Yu Dian
1588  Ergebnisse:
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1

Predictive Modelling of Optical Beams From Grating Structur..:

Lim, Yu Dian ; Zhao, Peng ; Guidoni, Luca..
Journal of Lightwave Technology.  42 (2024)  2 - p. 696-703 , 2024
Link: https://doi.org/10.1109/..
 
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2

Convolutional Neural Network Classification of Beam Profile..:

Lim, Yu Dian ; Tan, Chuan Seng
Applied Optics.  , 2024
Link: https://doi.org/10.1364/..
 
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3

Development of Grating for the Optical Addressing of Sr+ Io..:

Lim, Yu Dian ; Zhao, Peng ; Guidoni, Luca..
IEEE Photonics Journal.  15 (2023)  4 - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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4

Development of Mixed Pitch Grating for the Optical Addressi..:

Lim, Yu Dian ; Zhao, Peng ; Hu, Liangxing...
Optics Express.  , 2023
Link: https://doi.org/10.1364/..
 
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5

Development of Nitride-Based Optical Phased Array at 1092 n..:

Lim, Yu Dian ; Goh Chun Kiat, Simon ; Seit, Wen Wei...
IEEE Photonics Technology Letters.  35 (2023)  16 - p. 855-857 , 2023
Link: https://doi.org/10.1109/..
 
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6

CMOS-Fabricated Ring Surface Ion Trap with TSV Integration:

, In: 2023 International Electron Devices Meeting (IEDM),
Zhao, Peng ; Lim, Yu Dian ; Li, Hongyu... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

Reliability Study of Two-Step Plasma-Activated Copper-Coppe..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Hu, Liangxing ; Lim, Yu Dian ; Zhong Lim, Michael Joo... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Simplified Assembly of Through-Silicon-Via Integrated Ion T..:

Zhao, Peng ; Li, Hong Yu ; Likforman, Jean-Pierre...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  9 - p. 1337-1343 , 2023
Link: https://doi.org/10.1109/..
 
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9

Time Evolution Study of Two-Step Plasma-Treated Copper-Copp..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng... - p. 45-46 , 2023
Link: https://doi.org/10.23919..
 
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10

Modeling and Predicting the Beam Properties from Grating St..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Yu Dian ; Zhao, Peng ; Guidoni, Luca.. - p. 133-136 , 2023
Link: https://doi.org/10.1109/..
 
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11

Plasma-Activated Cu-Cu Direct Bonding in Ambient for Die-Di..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng.. - p. 276-278 , 2022
Link: https://doi.org/10.1109/..
 
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12

Comparative Study of Die-Attach Materials for LED Die Bondi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hu, Liangxing ; Bao, Shuyu ; Wang, Yue... - p. 447-451 , 2022
Link: https://doi.org/10.1109/..
 
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13

Ceramic Pin Grid Array with Built-in Interconnects to Locat..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Zhao, Peng ; Li, Hong Yu ; Lim, Yu Dian... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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14

Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hu, Liangxing ; Lim, Yu Dian ; Zhao, Peng.. - p. 324-329 , 2022
Link: https://doi.org/10.1109/..
 
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15

Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hu, Liangxing ; Goh, Simon Chun Kiat ; Lim, Yu Dian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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