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Lim Pei Siang, Sharon
50  Ergebnisse:
Personensuche X
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1

Yield Improvement in Chip to Wafer Hybrid Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choong Chong, Ser ; Cereno Daniel, Ismael ; Lim Pei Siang, Sharon... - p. 1982-1986 , 2022
Link: https://doi.org/10.1109/..
 
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2

Heterogeneous System Level Integration Using Active Si Inte..:

Chidambaram, Vivek ; Lim Pei Siang, Sharon ; Xiangyu, Wang..
IEEE Journal of the Electron Devices Society.  7 (2019)  - p. 1209-1216 , 2019
Link: https://doi.org/10.1109/..
 
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3

Numerical and Experimental Investigation of Package Warpage..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Lim, Sharon Pei Siang ; Lau, Boon Long... - p. 734-737 , 2023
Link: https://doi.org/10.1109/..
 
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4

Assembly challenges and demonstrations of ultra-large Anten..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Wee, David Ho Soon. - p. 635-642 , 2022
Link: https://doi.org/10.1109/..
 
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5

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chong, Ser Choong ; Seit, Wen Wei... - p. 945-950 , 2022
Link: https://doi.org/10.1109/..
 
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6

Development of wafer level solderball placement process for..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Jaafar, Norhanani ; Chong, Ser Choong.. - p. 435-439 , 2020
Link: https://doi.org/10.1109/..
 
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7

Board Level Solder Joint Reliability Design and Analysis of..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Zhang, Xiaowu ; Lau, Boon Long ; Chen, Haoran... - p. 316-320 , 2020
Link: https://doi.org/10.1109/..
 
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8

Development of 2.5D high density device on large ultra-thin..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lim, Sharon Pei Siang ; Chidambaram, Vivek ; Jaafar, Norhanani. - p. 247-252 , 2019
Link: https://doi.org/10.1109/..
 
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9

Application of Piezoresistive Stress Sensor in Mold-1st Fan..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Bu, Lin ; Jong, Ming Chinq ; Lau, Boon Long... - p. 28-33 , 2019
Link: https://doi.org/10.1109/..
 
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10

Development of low profile fan out PoP solution with embedd..:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
Jung, Boo Yang ; Ho, David Soon Wee ; Sorono, Dexter Velez... - p. 597-600 , 2014
Link: https://doi.org/10.1109/..
 
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11

Characterization of DAF tape for embedded micro wafer level..:

, In: 2009 11th Electronics Packaging Technology Conference,
Pei-Siang, Sharon Lim ; Sharma, Gaurav ; Kumar, Aditya.. - p. None , 2009
Link: https://doi.org/10.1109/..
 
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12

Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Rotaru, Mihai ; Xiangyu, Wang... - p. 2017-2023 , 2024
Link: https://doi.org/10.1109/..
 
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13

Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siang Lim, Sharon Pei ; Long Lau, Boon ; Chai, Tai Chong. - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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14

Wafer Warpage Optimization Via Finite Element Analysis for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ji, Lin ; Chai, Tai Chong ; Siang Lim, Sharon Pei - p. 707-711 , 2022
Link: https://doi.org/10.1109/..
 
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15

NetFlex: A 22nm Multi-Chiplet Perception Accelerator in Hig..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chou, Teyuh ; Tang, Wei ; Rotaru, Mihai D.... - p. 208-209 , 2022
Link: https://doi.org/10.1109/..
 
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