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Lin, Chrong-Jung
137  Ergebnisse:
Personensuche X
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1

A Study of Physical Unclonable Function by Dielectric Break..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Geng-Shiu ; King, Ya-Chin ; Lin, Chrong-Jung - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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2

Complementary Detectors for DUV Sensing by CMOS Logic Techn..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Huang, Ting-Kai ; Yeh, Hsin-Hung ; Shih, Jiaw-Ren.. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

Application of twin-bit self-rectifying via RRAM with uniqu..:

Lin, Yu-Cheng ; Huang, Yao-Hung ; Chuang, Kai-Ching...
Japanese Journal of Applied Physics.  63 (2024)  2 - p. 02SP55 , 2024
Link: https://doi.org/10.35848..
 
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4

Advanced self-convergent calibration for selenized two-dime..:

Liu, Che-Chuan ; Shen, Hsin-Yi ; Wang, Kuangye...
Japanese Journal of Applied Physics.  63 (2024)  2 - p. 02SP34 , 2024
Link: https://doi.org/10.35848..
 
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5

High-density via RRAM cell with multi-level setting by curr..:

Hsieh, Yu-Cheng ; Lin, Yu-Cheng ; Huang, Yao-Hung...
Discover Nano.  19 (2024)  1 - p. , 2024
Link: https://doi.org/10.1186/..
 
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6

Offset-Via Anti-fuse by Cu BEOL Process in Advanced CMOS Te..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Yeh, Li-Yu ; Lin, Chrong-Jung ; King, Ya-Chin - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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7

Characterization and Current Modeling of Stacked high-$\kap..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Chao, Gui-Sheng ; Chen, Wei-Hua ; Chen, Kuan-Ju.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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8

CMOS compatible 2T pixel for on-wafer in-situ EUV detection:

Lin, Wei-Hwa ; Huang, Han-Lin ; Wu, Pin-Jiun..
Discover Nano.  18 (2023)  1 - p. , 2023
Link: https://doi.org/10.1186/..
 
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9

3-D Stackable Offset-Via Antifuse by Cu BEOL Process in Adv..:

Yeh, Li-Yu ; Chang, Ya-Lin ; Chih, Yue-Der...
IEEE Transactions on Electron Devices.  70 (2023)  12 - p. 6273-6278 , 2023
Link: https://doi.org/10.1109/..
 
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10

Multilevel Fully Logic-Compatible Latch Array for Computing..:

Yeh, Ming-Shyue ; Wang, Ya-Ching ; Huang, Yao-Hung...
IEEE Transactions on Electron Devices.  70 (2023)  4 - p. 2001-2008 , 2023
Link: https://doi.org/10.1109/..
 
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11

2T-Pixel Sensors Array for on-Wafer in-Chamber DUV Sensing:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lin, Wei-Hwa ; Wang, Chien-Ping ; Shih, Jiaw-Ren.. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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12

An Investigation of Plasma Charging Effect on FinFET Front-..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Yang, Kai-Wei ; Chao, Yi-Jie ; Shih, Jiaw-Ren.. - p. 384-386 , 2022
Link: https://doi.org/10.1109/..
 
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13

Design and optimization of multiple-time programmable memor..:

Chuang, Chun-Yu ; Lin, Chrong-Jung ; King, Ya-Chin
Japanese Journal of Applied Physics.  60 (2021)  SB - p. SBBB04 , 2021
Link: https://doi.org/10.35848..
 
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14

Wide range detector of plasma induced charging effect for a..:

Chao, Yi-Jie ; Yang, Kai-Wei ; Su, Chi..
Nanoscale Research Letters.  16 (2021)  1 - p. , 2021
Link: https://doi.org/10.1186/..
 
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15

Test Pattern Design for Plasma Induced Damage on Inter-Meta..:

Su, Chi ; Tsai, Yi-Pei ; Lin, Chrong-Jung.
Nanoscale Research Letters.  15 (2020)  1 - p. , 2020
Link: https://doi.org/10.1186/..
 
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