Lin, Sam
1544  Ergebnisse:
Personensuche X
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1

Hybrid plasmonic valley-Hall topological insulators:

Lin, Sam ; Wong, Zi Jing
Nanophotonics.  13 (2024)  15 - p. 2811-2817 , 2024
 
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3

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024
 
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4

Antenna-in-Package Electrical Research for Beyond 5G applic..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny.. - p. 63-66 , 2023
 
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5

Electrical Performance Enhancement Solution with FO-EB in H..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Su, Po Yuan James ; Ho, David ; Wang, Yu Po... - p. 1-5 , 2023
 
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6

Initial Upper Paleolithic in North China: New data from Shu..:

Peng, Fei ; Chen, Guo ; Pei, Shuwen..
Archaeological Research in Asia.  36 (2023)  - p. 100484 , 2023
 
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7

Innovative Fan-Out Embedded Bridge Structure for Co-Package..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Li, Jay ; Hsu, Terry ; Zhuan, Ming-Han... - p. 228-232 , 2023
 
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8

Design of Single Miniaturized Dielectric Resonant Antenna f..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny... - p. 1820-1824 , 2023
 
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10

Nonlinear Finite Element Analysis of An Automotive High-Pow..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chen, Liangbiao ; Liu, Yong ; Yao, Alex.. - p. 1589-1593 , 2022
 
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11

Fan-Out Higher Layer Heterogeneous Solution in HPC Applicat..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Kao, Feng ; Wang, David ; Lin, Sam... - p. 01-03 , 2022
 
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14

The Application of 3D Photogrammetry for In-Field Documenta..:

Douglass, Matthew ; Lin, Sam ; Chodoronek, Michael
Advances in Archaeological Practice.  3 (2015)  2 - p. 136-152 , 2015
 
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