Lin, Shane
859  Ergebnisse:
Personensuche X
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1

High Power Advanced Package with Water Cooling System Evalu..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lin, Shane ; Lin, Dan ; Lin, Vito... - p. 1-5 , 2023
 
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2

High Thermal Solution for 3D Integration Package:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Ching Chia ; Kao, Nicholas ; Wang, Yu Po.. - p. 1026-1029 , 2023
 
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3

High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Su, Pin-Jing ; Lin, Dan ; Lin, Shane... - p. 1224-1227 , 2022
 
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4

TIM Coverage Evaluation for High Performance Computing Appl..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Lin, Shane ; Zhang, Ken ; Lin, Vito.. - p. 1-5 , 2022
 
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11

The Statehood of Taiwan:

, In: China and Taiwan in Africa; Africa-East Asia International Relations,
 
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