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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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High Power Advanced Package with Water Cooling System Evalu..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
2
High Thermal Solution for 3D Integration Package:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
High Thermal Graphite TIM Solution Applied to Fan-Out Platf..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
4
TIM Coverage Evaluation for High Performance Computing Appl..:
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China and Taiwan in Africa; Africa-East Asia International Relations ,
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