Liu, Allan
2794  Ergebnisse:
Personensuche X
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1

Ultrasonically enhanced flux-less bonding with Zn-5Al alloy..:

Liu, Canyu ; Liu, Allan ; Su, Yutai...
Journal of Manufacturing Processes.  73 (2022)  - p. 139-148 , 2022
 
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3

Self-propagating exothermic reaction assisted Cu clip bondi..:

Liu, Canyu ; Liu, Allan ; Jiang, Han...
Microelectronics Reliability.  138 (2022)  - p. 114688 , 2022
 
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5

Bonding with Zn-based solders through self-propagating exot..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Liu, Canyu ; Jiang, Han ; Liang, Shuibao... - p. 439-442 , 2022
 
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6

Nano Ag sintering on Cu substrate assisted by self-assemble..:

Liu, Canyu ; Liu, Allan ; Su, Yutai..
Microelectronics Reliability.  126 (2021)  - p. 114241 , 2021
 
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7

Thermo-elasto-plastic phase-field modelling of mechanical b..:

Su, Yutai ; Fu, Guicui ; Liu, Changqing...
Computer Methods in Applied Mechanics and Engineering.  378 (2021)  - p. 113729 , 2021
 
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8

Investigation of wear mechanics and behaviour of NiCr metal..:

Liu, Allan ; Marshall, Matthew ; Rahimov, Eldar.
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science.  236 (2021)  9 - p. 4962-4972 , 2021
 
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9

Investigation of Thermo-mechanical and Phase-change Behavio..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Liang, Shuibao ; Zhong, Yi ; Robertson, Stuart... - p. 269-275 , 2020
 
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10

Ultrasonic-assisted nano Ag-Al alloy sintering to enable hi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Liu, Canyu ; Liu, Allan ; Zhong, Yi... - p. 1999-2004 , 2020
 
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12

Quasi-ambient Bonding Semiconductor Components for Power El..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Zhong, Yi ; Liu, Allan Yu ; Robertson, Stuart... - p. 1468-1473 , 2020
 
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