Liu, Canyu
137  Ergebnisse:
Personensuche X
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6

Development of micron-sized Cu–Ag composite paste for oxida..:

Chen, Chuantong ; Kim, Dongjin ; Liu, Yang...
Journal of Materials Research and Technology.  24 (2023)  - p. 8967-8983 , 2023
 
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11

Bonding with Zn-based solders through self-propagating exot..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Liu, Canyu ; Jiang, Han ; Liang, Shuibao... - p. 439-442 , 2022
 
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12

Self-propagating exothermic reaction assisted Cu clip bondi..:

Liu, Canyu ; Liu, Allan ; Jiang, Han...
Microelectronics Reliability.  138 (2022)  - p. 114688 , 2022
 
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Ultrasonically enhanced flux-less bonding with Zn-5Al alloy..:

Liu, Canyu ; Liu, Allan ; Su, Yutai...
Journal of Manufacturing Processes.  73 (2022)  - p. 139-148 , 2022
 
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