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2024 International Conference on Electronics Packaging (ICEP) ,
7
Advanced Fan-Out Embedded Chip Process Integration for 3D A..:
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2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
8
A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Co..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
10
A 28nm 1Mb Time-Domain Computing-in-Memory 6T-SRAM Macro wi..:
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2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
11
CMOS-compatible GaN HEMT on 200mm Si-substrate for RF appli..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
13
A Comprehensive Modeling Framework for Ferroelectric Tunnel..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
14