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Lois, Liao Jinzhi
46  Ergebnisse:
Personensuche X
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1

Faster AU-AL IMC Growth Under Chlorine Environment:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Study of moisture penetration in chip passivation layer by ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Application of deuterium oxide (D2O) isotope tracing techni..:

Lois, Liao Jinzhi ; Meng, Tian ; Yong, Du...
Microelectronics Reliability.  135 (2022)  - p. 114607 , 2022
Link: https://doi.org/10.1016/..
 
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4

Chlorine and sulfur effects on copper-aluminum wire bond re..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 749-752 , 2022
Link: https://doi.org/10.1109/..
 
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5

Studies of Electron Backscattered Diffraction (EBSD) Analys..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Younan, Hua ; Binghai, Liu ; Lois, Liao Jinzhi... - p. 821-825 , 2022
Link: https://doi.org/10.1109/..
 
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6

Study of moisture penetration in polymer encapsulant by deu..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 826-828 , 2022
Link: https://doi.org/10.1109/..
 
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7

Comprehensive Comparison of the Wire Bond Reliability Perfo..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Lois, Liao Jinzhi ; Minglang, Yu ; Weikok, Tee... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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8

bHAST, PCT, TCT reliability performance comparison of Cu-Al..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Weikok, Tee ; Minglang, Yu... - p. 63-67 , 2020
Link: https://doi.org/10.1109/..
 
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9

Enhancing High Temperature Adhesion Performance Via a Renov..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Neoh, Din-Ghee ; Weikok, Tee ; Lois, Liao Jinzhi... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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10

Comprehensive study of wire bond reliability impacts from w..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Songlin, Mao ; Bisheng, Wang... - p. 197-202 , 2019
Link: https://doi.org/10.1109/..
 
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11

Reliability study of Au-Al wire bond under Cl environment:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liao, Jinzhi Lois ; Wang, Bisheng ; Zhang, Xi.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Chlorine effect on copper bonding wire reliability:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Liao, Jinzhi Lois ; Wang, Bisheng ; Zhang, Xi.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Studies of Passivation (Si3N4/SiO2) Qualification Method in..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Hua, Younan ; Liao, Jinzhi Lois ; Liu, Binhai.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

A study on an abnormal oxidation issue of copper bonding wi..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Jinzhi, Lois Liao ; Jianbo, Song ; Lei, Zhu... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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15

Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wi..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Bisheng, Wang ; Jinzhi, Lois Liao ; Xi, Zhang... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
1-15