Loizou, Loizos
30  Ergebnisse:
Personensuche X
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5

The rare DNA ligase IV syndrome: A case report:

Gerasimou, Petroula ; Koumas, Laura ; Miltiadous, Andri...
Human Pathology: Case Reports.  22 (2020)  - p. 200442 , 2020
 
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Technical Viability of Retro-Filling C3F7CN/CO2 Gas Mixture..:

Loizou, Loizos ; Chen, Lujia ; Liu, Qiang...
IEEE Transactions on Power Delivery.  35 (2020)  5 - p. 2394-2402 , 2020
 
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Design of a compact, fully‐autonomous 433 MHz tunable anten..:

Buckley, John L. ; McCarthy, Kevin G. ; Gaetano, Domenico...
IET Microwaves, Antennas & Propagation.  11 (2016)  4 - p. 548-556 , 2016
 
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12

Application of SF6 Alternatives for Retro-filling Existing ..:

Loizou, Loizos ; Chen, Tony Lujia ; Liu, Qiang...
Loizou , L , Chen , T L , Liu , Q , Waldron , M , Wilson , G & OWENS , J 2023 , ' Application of SF6 Alternatives for Retro-filling Existing Equipment ' , CIGRE Science & Engineering ..  , 2023
 
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Partial Discharge Characteristics of C3F7CN Gas Mixture Usi..:

Loizou, Loizos ; Han, Qinghua ; Chen, Lujia...
Loizou , L , Han , Q , Chen , L , Liu , Q , Waldron , M , Wilson , G , Bautista , R F & Seltzer-Grant , M 2022 , ' Partial Discharge Characteristics of C3F7CN Gas Mixture Using the UHF Method ' , Energies , vol. 15 , no. 20 , pp. 7731 . https://doi.org/10.3390/en15207731.  , 2022
 
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Technical Viability of Retro-filling C3F7CN/CO2 Gas Mixture..:

Loizou, Loizos ; Chen, Tony ; Liu, Qiang...
Loizou , L , Chen , T , Liu , Q , Cotton , I , Waldron , M & Owens , J 2020 , ' Technical Viability of Retro-filling C3F7CN/CO2 Gas Mixtures in SF6-designed Gas Insulated Lines and Busbars at Transmission Voltages ' , IEEE Transactions on Power Delivery , vol. 35 , no. 5 , 9019889 , pp. 2394-2402 . https://doi.org/10.1109/TPWRD.2020.2967582.  , 2020
 
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A Comparative Study on the Breakdown Characteristics of SF6..:

Loizou, Loizos ; Chen, Tony ; Liu, Qiang
Loizou , L , Chen , T & Liu , Q 2020 , A Comparative Study on the Breakdown Characteristics of SF6 and 20% C3F7CN / 80% CO2 Gas Mixture in a Coaxial Configuration . in IEEE Conference on Electrical Insulation and Dielectric Phenomena . IEEE Conference on Electrical Insulation and Dielectric Phenomena , Washington , United States , 20/10/19 . https://doi.org/10.1109/CEIDP47102.2019.9009877.  , 2020
 
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