Loke Sheng, Foo
74  Ergebnisse:
Personensuche X
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1

Increased Fault Isolation Efficiency by Using Scan Cell Vis..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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2

Integration of Soft Defect Localization (SDL) and Electro-O..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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3

Test And Reliability Improvement With Defect-Image Classifi..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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4

Recovered Scan Failure Investigation and Failure Mechanism ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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5

Novel Non-Destructive Physical Bitmap Verification Techniqu..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
 
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6

Unravelling CO2 capture performance of microalgae cultivati..:

Cheng, Yoke Wang ; Lim, Jeremy Sheng Ming ; Chong, Chi Cheng...
Journal of Environmental Chemical Engineering.  9 (2021)  6 - p. 106519 , 2021
 
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8

Contributors:

, In: Cancer,
Abiri, Behnaz ; Afrin, Sadia ; Aguilera, Yolanda... - p. xix-xxiv , 2021
 
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11

Sarcoidosis: Immunopathogenesis and Immunological Markers:

Loke, Wei Sheng Joshua ; Herbert, Cristan ; Thomas, Paul S.
International Journal of Chronic Diseases.  2013 (2013)  - p. 1-13 , 2013
 
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12

Stakeholder engagement in emerging economies: considering t..:

Min Foo, Loke ; Lenssen, Gilbert
Corporate Governance: The international journal of business in society.  7 (2007)  4 - p. 379-387 , 2007
 
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13

Signal and Power Integrity Design of Advanced Interface Bus..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Wang, Brian ; Chen, Guang ; Foo, Loke Yip. - p. 1-3 , 2023
 
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14

Haematological Prehabilitation:

, In: Prehabilitation for Cancer Surgery,
 
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15

Power Delivery Network Step Load Response and 1st Droop For..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Foo, Loke Yip - p. 1-6 , 2019
 
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